Circuit Module Shielding with Columnar Conductive Poles
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Solution Overview
Problem
Conductive components in conventional circuit modules occupy a large space due to their wall-like form, leading to increased module size and electromagnetic wave interference between electronic components.
Innovation Solution
A circuit module design featuring columnar conductive poles within a resin mold, arranged to connect the conductive shield to the circuit board ground, with specific dimensions and spacing to minimize electromagnetic interference while maintaining compact size, using Formula (1) to ensure resonance frequencies are above the maximum usable frequency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If wall-like conductive components are used to electromagnetically shield electronic components, then electromagnetic wave interference is prevented, but the circuit module size increases
Solution Approach 1:
The conductive shield is divided into multiple discrete conductive poles rather than using a continuous wall-like structure. These poles are strategically positioned within the resin mold to provide electromagnetic shielding through segmentation, reducing the overall space required while maintaining shielding effectiveness.
Solution Approach 2:
The design changes the geometric parameters of the shielding structure from wall-like forms to columnar poles with specific dimensions. The pole diameter is set to 0.5-2.0mm and spacing is controlled to be 0.5-5.0mm, optimizing the balance between shielding performance and space utilization.
2Object-affected harmful factors
If conductive poles are arranged closely to improve shielding, then electromagnetic wave interference is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The design specifies optimal parameter ranges for pole spacing (0.5-5.0mm) and diameter (0.5-2.0mm) that balance shielding effectiveness with manufacturing feasibility. These parameters are chosen to maintain shielding performance while accommodating typical manufacturing tolerances.
Solution Approach 2:
The conductive poles are strategically positioned at locations where electromagnetic interference is most problematic, rather than requiring uniform dense distribution throughout the entire structure. This localized approach maintains shielding effectiveness while reducing overall complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents electromagnetic wave interference between electronic components with minimal increase in module size, improving isolation characteristics and reducing unwanted emissions by restricting resonance frequencies.
Implementation Method 1
a conductive shield covering a top surface and side surfaces of the resin mold; and a plurality of conductive poles having a columnar shape provided in the resin mold and connecting a top surface of the conductive shield and the ground of the circuit board
Implementation Method 2
the plurality of conductive poles are arranged such that a distance between two closest conductive poles is equal to or less than one-fourth of a wavelength at the predetermined maximum usable frequency in the resin mold. Here, the 'wavelength at the predetermined maximum usable frequency in the resin mold' refers to a wavelength of an electromagnetic wave having the predetermined maximum usable frequency shortened by the wavelength reduction effect in the resin mold having a larger dielectric constant than the air
Data Source
AI summary
One object is to prevent electromagnetic wave interference between electronic components with restricted increase of the size of a circuit module. A circuit module according to an embodiment includes a circuit board, a plurality of electronic components provided on the circuit board, a resin mold provided on the circuit board so as to seal the plurality of electronic components in an insulating manner, a conductive shield covering the top surface and the side surfaces of the resin mold, and a plurality of conductive poles having a columnar shape provided in the resin mold and connecting the top surface of the conductive shield and the ground of the circuit board. The resonance caused by frequencies equal to or less than a predetermined maximum usable frequency is restricted.