Circuit Module Shielding via Sealing Body Trench
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Solution Overview
Problem
Existing circuit modules face challenges in maintaining stable shielding effectiveness between mount components and preventing deterioration of signal characteristics due to lengthy connections and inadequate grounding of inner shields.
Innovation Solution
A circuit module design featuring a trench formed on the sealing body rather than the substrate, allowing for shorter connections between mount components via surface wiring layers and improved grounding of inner shields, which reduces resistance and enhances shielding effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the trench is formed into the circuit substrate, then the inner shield can be connected to ground terminal, but the connection length between components is prolonged and signal characteristics deteriorate
Solution Approach 1:
Instead of forming the trench into the circuit substrate as in conventional technology, the patent inverts the approach by forming the trench only into the sealing body. This reversal allows the inner shield to be connected to the surface wiring layer through the trench bottom, achieving effective shielding while keeping connection lengths short and maintaining signal characteristics.
2Reliability
If the conductor is connected to ground terminal on substrate surface layer, then shielding can be provided, but sufficient connection and stable shielding effectiveness are difficult to achieve
Solution Approach 1:
The patent introduces the surface wiring layer as an intermediary element that facilitates reliable connection between the inner shield and the grounding system. The trench is formed to expose the surface wiring layer, which then serves as the connection point for the inner shield, ensuring stable and sufficient electrical connection for effective shielding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design shortens connection lengths, stabilizes signal characteristics, and improves shielding effectiveness by allowing direct connection of inner shields to the surface wiring layer, preventing electromagnetic interference and module failure.
Implementation Method 1
an electromagnetic shield is formed on a sealing body covering the mount components to prevent an interruption (electromagnetic interruption) caused by electromagnetic waves within and outside of the module
Implementation Method 2
the trenches are filled with a conductive material to provide the inner shields
Data Source
AI summary
There is provided a circuit module including a circuit substrate being a wiring substrate having a mount surface, a surface wiring layer disposed on the mount surface, and an inner wiring layer formed within the substrate, a first mount component mounted on the mount surface, a second mount component mounted on the mount surface, and electrically connected to the first mount component via the inner wiring layer, a sealing body formed on the mount surface, covering the first mount component and the second mount component and having a trench formed from a main surface of the sealing body to the surface wiring layer between the first mount component and the second mount component, and a shield having an inner shield section formed within the trench that abuts on the surface wiring layer and an outer shield section covering the sealing body and the inner shield section.