Circuit Module Layout for Stable Upper Component Mounting

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Solution Overview

Problem

The displacement of the position and posture of the second electronic component in conventional electronic circuit modules due to solder melting during manufacturing can cause malfunctions.

Innovation Solution

The electronic circuit module design includes a substrate with a first electronic component mounted on one main surface, a second electronic component supported on a support surface opposite to the first, a conductor on the support surface, a wire connecting the conductor to a substrate electrode, and a component electrode on the second electronic component, allowing for electrical connection without relying on pillars, which reduces displacement and facilitates easier wiring and heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If pillars are used to support the second electronic component, then the component can be positioned above the substrate, but displacement occurs due to solder melting during manufacturing

Engineering Contradiction:

Improveposition stability of second electronic componentVSAvoidfunctional reliability of electronic circuit module

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent removes the pillar structure entirely from the design. Instead of supporting the second electronic component on pillars above the substrate, the component is mounted directly on the substrate surface, eliminating the source of displacement problems associated with soldered pillars

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent segments the electrical connection function from the mechanical support function. Electrical connections are achieved through separate conductor elements and wiring rather than relying on pillars to provide both structural support and electrical connectivity

Inventive Principle:

Principle #1Segmentation

2Device complexity

If pillars are used for support, then vertical space is utilized, but wiring complexity increases and thermal dissipation is reduced

Engineering Contradiction:

Improvewiring complexityVSAvoidthermal dissipation capability

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The patent transitions from vertical stacking (using pillars to elevate components) to a planar arrangement where components are distributed across the substrate surface. This dimensional change simplifies wiring by reducing the need for vertical interconnections and improves thermal dissipation through better contact with the substrate

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12446159B2Electronic circuit module

Publication Date: 2025.10.14 MURATA MFG CO LTD

AI summary

An electronic circuit module includes: a substrate; a first electronic component mounted on one main surface of the substrate; a substrate electrode provided on the one main surface; a second electronic component supported on a support surface opposite to a surface facing the one main surface of the first electronic component; a conductor provided on the support surface of the first electronic component; a wire connected to the conductor and the substrate electrode; and a component electrode provided on a surface of the second electronic component and electrically connected to the conductor.