Electronic Circuit Module Layout for Stable Component Positioning

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Solution Overview

Problem

Conventional electronic circuit modules experience displacement and malfunction due to solder melting during manufacturing, affecting the position and posture of second electronic components.

Innovation Solution

An electronic circuit module design where the second electronic component is supported by a surface opposite to the first electronic component, with a conductive portion electrically connected to a component electrode, separated from the support surface of the first electronic component, and a grounding part to shield electromagnetic waves.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the second electronic component is supported by pillars with solder, then the component can be mounted and electrically connected, but the solder may melt during manufacturing causing displacement and posture shifts

Engineering Contradiction:

Improveposition stabilityVSAvoidposition precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent introduces a support surface (opposite surface) as an intermediary structure between the second electronic component and the substrate. This support surface directly contacts and supports the second electronic component, eliminating the need for solder-based pillars that are prone to melting and displacement during manufacturing. The intermediary support surface provides stable mechanical support without the thermal sensitivity of solder joints.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces the mechanical solder-based pillar support system with a mechanical support surface system. Instead of relying on melted solder to form supportive pillars, the design uses a dedicated support surface that mechanically supports the second electronic component from the opposite side, providing more reliable positional stability during manufacturing and operation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If the conductive portion is close to the support surface for electrical connection, then connectivity is improved, but the risk of damage from solder contact increases

Engineering Contradiction:

Improveelectrical connectivityVSAvoiddamage risk

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent uses the support surface as an intermediary barrier between the conductive portion and the harmful solder environment. The conductive portion is positioned to be electrically connected through the support surface structure, which protects it from direct contact with molten solder during manufacturing, thus reducing damage risk while maintaining electrical connectivity.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent resolves the conflict by transitioning to a three-dimensional arrangement where the conductive portion is positioned in a different spatial dimension relative to the support surface. Instead of placing the conductive portion directly on the support surface where it would contact solder, the design uses vertical separation while maintaining electrical connection through the support structure, effectively using the third dimension to avoid harm.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration suppresses displacement and posture issues of the second electronic component, reduces the risk of damage from solder contact, and effectively shields electromagnetic interference, enhancing module reliability and performance.

Implementation Method 1

a conductor including a connection part connecting the substrate electrode and the component electrode

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

a grounding part to shield electromagnetic waves

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS20240014121A1Electronic circuit module

Publication Date: 2024.01.11 MURATA MFG CO LTD

AI summary

An electronic circuit module includes a substrate, a first electronic component mounted on one principal surface of the substrate, a substrate electrode provided on the one principal surface, a second electronic component supported by a support surface opposite to a surface of the first electronic component facing the one principal surface, a component electrode provided on a surface of the second electronic component, and a conductor including a connection part connecting the substrate electrode and the component electrode. The second electronic component includes a conductive portion electrically connected to the component electrode. The conductive portion is separated from a support surface of the first electronic component.