Circuit Module Thermal Management via Metallic Substrate
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Solution Overview
Problem
High-density circuit modules, such as DIMMs, face challenges with thermal management due to limited profile space and the low thermal conductivity of conventional substrates like FR4, leading to heat accumulation and potential mechanical stress from insertion pressure.
Innovation Solution
A circuit module design that incorporates a flex circuit with ICs wrapped around a metallic substrate, thermally connected to a chassis either directly or through a thermally conductive conduit, allowing for efficient heat dissipation and enhanced mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional FR4 substrate is used for circuit module, then manufacturing is easy and cost is low, but thermal conductivity is low causing heat accumulation
Solution Approach 1:
The patent employs a composite substrate structure combining FR4 base material with copper layers and thermally conductive materials. The copper layers are integrated into the FR4 substrate to create a composite structure that maintains the ease of manufacturing FR4 while significantly improving thermal conductivity through the high thermal conductivity of copper.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the substrate by adding copper layers and thermally conductive materials. This modifies the physical properties of the substrate without fundamentally changing the manufacturing process, thereby improving heat dissipation while maintaining manufacturing feasibility.
2Reliability
If insertion pressure is applied to DIMM in edge connector, then electrical connection is established, but board flexing causes IC cracking or joint separation
Solution Approach 1:
The patent incorporates compliant mounting structures and flexible circuit board designs that can absorb insertion pressure before it reaches the ICs and joints. These cushioning elements deform under pressure to reduce the mechanical stress transmitted to sensitive components, preventing cracking and separation.
Solution Approach 2:
The patent uses flexible circuit board designs where the PCB itself acts as a flexible element that can bend and absorb insertion forces. This flexibility allows the board to accommodate pressure without transmitting damaging forces to the mounted ICs and joints, thereby protecting them from failure.
3Volume of moving object
If profile space is limited in chassis, then device size is compact, but thermal energy loading demands are exacerbated
Solution Approach 1:
The patent introduces thermally conductive materials and copper layers as intermediary elements between the ICs and the FR4 substrate. These intermediaries act as thermal pathways that conduct heat away from the compact ICs efficiently, enabling effective thermal management within the limited profile space of the chassis.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively manages thermal loading by enhancing thermal conductivity and mechanical reliability, reducing the risk of IC damage and improving module performance in constrained spaces.
Implementation Method 1
The substrate is thermally connected to a chassis component either directly or through a thermal conduit such as a thermally conductive compliant material or spring in thermal contact with the chassis component
Implementation Method 2
A substrate with first and second lateral sides provides a form for the module. That substrate is preferably comprised of metallic material and exhibits an edge about which the flex circuit is wrapped. The substrate is thermally connected to a chassis component either directly or through a thermal conduit such as a thermally conductive compliant material or spring in thermal contact with the chassis component
Data Source
AI summary
A circuit module shunts thermal energy into a chassis component or a part of the box of the computing application in which the module is employed. In one preferred mode, a flex circuit is populated along each of its first and second major sides with two ranks of ICs which are, preferably, array type (CSP) devices. Insertion contacts are disposed in two sets on the first side of the flex circuit typically between the two ranks of ICs along the first side of the IC. A substrate with first and second lateral sides provides a form for the module. That substrate is preferably comprised of metallic material and exhibits an edge about which the flex circuit is wrapped and an extension at the other extremity of the substrate that is thermally connected to a chassis component of the application, either directly or, preferably, through a thermal conduit such as a thermally conductive compliant material.