Electronic Circuit Module Vertical Stacking for Miniaturization
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Solution Overview
Problem
There is a need for downsized electronic circuit modules, particularly for applications like digital cameras and endoscopes, where reducing the diameter and length of the tip end portion of the insertion tool is essential to minimize patient burden, and existing technologies have not effectively addressed the challenge of miniaturizing the electronic circuit modules while maintaining reliable connections.
Innovation Solution
The electronic circuit module design includes a substrate with a wiring pattern, solid wire cables with exposed conductor portions, and electronic components with terminals on opposed faces, where the conductor portions are directly connected to the terminals, allowing for reduced area requirements and efficient mounting by exposing the core and insulator portions to facilitate connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the electronic circuit module is downsized to reduce the diameter and length of the tip end portion, then the portability and patient burden are reduced, but the mounting area and connection reliability may be compromised
Solution Approach 1:
The patent transitions from planar mounting to three-dimensional vertical stacking by utilizing the Z-axis direction. Multiple conductor portions are arranged at different heights, with upper conductor portions connected to upper terminals and lower conductor portions connected to lower terminals of the electronic component, enabling compact mounting while maintaining connection reliability.
Solution Approach 2:
The cable is segmented into multiple conductor portions (first, second, third conductor portions) with different insulation removal patterns. Each conductor portion can be independently connected to corresponding terminals, allowing flexible spatial arrangement and reliable connections within a compact volume.
2Volume of moving object
If the electronic circuit module is downsized, then the device size is reduced, but the area required for mounting increases relative to the available space
Solution Approach 1:
The patent utilizes the vertical dimension (Z-axis) to arrange conductor portions and terminals in multiple layers. The first conductor portion is positioned at a first height, the second conductor portion at a second height, and the third conductor portion at a third height, enabling three-dimensional space utilization that reduces the footprint mounting area while accommodating all necessary connections.
Solution Approach 2:
The patent employs a nested arrangement where conductor portions and electronic components are positioned within each other's spatial envelopes. The cable with its multiple conductor portions is positioned such that upper and lower portions are nested vertically, allowing efficient space utilization and reduced mounting area.
Data Source
AI summary
An electronic circuit module includes: a substrate on which a wiring pattern having an electrode portion is formed; a cable having an external insulator and a conductor portion, at least a distal end side of the external insulator being removed to expose a conductor, an exposed portion of the conductor being defined as the conductor portion; and an electronic component having terminals at least on two opposed faces of the electronic component. At least one of the terminals of the electronic component is directly connected to the conductor portion, and is configured to be electrically connected to the electrode portion through the conductor portion.