Electronic Circuit Package Composite Shielding Structure
Solution Overview
Problem
Conventional electronic circuit packages face challenges in achieving high composite shielding effects due to insufficient electromagnetic and magnetic shielding, particularly in miniaturized devices where noise and radio disturbances are prevalent, and existing solutions like metal casings and two-layered structures fail to provide adequate shielding without increasing height or compromising performance.
Innovation Solution
An electronic circuit package design incorporating a substrate with a power supply pattern, a magnetic mold resin made of composite magnetic material, and a laminated film composed of a metal film and a magnetic film with higher effective permeability, where the metal film is connected to the power supply pattern and the magnetic film has double or more effective permeability than the resin, enhancing shielding effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal casing covers the entire body of the electronic circuit package, then electromagnetic shielding is improved, but device height increases and manufacturing complexity worsens
Solution Approach 1:
The shielding function is segmented into multiple layers: a magnetic mold resin layer embedded in the substrate, and a laminated film layer on the top surface. This segmentation allows shielding without requiring a complete metal casing, thus reducing device height while maintaining electromagnetic shielding effectiveness.
Solution Approach 2:
The invention uses composite materials including magnetic mold resin containing magnetic fillers and a laminated film with both metal and magnetic layers. This composite structure provides effective electromagnetic and magnetic shielding without requiring a solid metal casing, thereby reducing device height while improving shielding performance.
2Object-affected harmful factors
If a two-layered structure of magnetic mold resin and metal casing is used, then some shielding is achieved, but sufficient electromagnetic and magnetic shielding performance cannot be obtained
Solution Approach 1:
The invention employs a composite laminated film structure with at least a metal layer and a magnetic layer, where the magnetic layer has higher effective permeability than the magnetic mold resin. This composite multi-layer structure provides both electromagnetic shielding (metal layer) and magnetic shielding (magnetic layer), achieving sufficient shielding performance without excessive structural complexity.
Solution Approach 2:
The shielding structure is optimized with local quality differentiation: the magnetic mold resin is embedded in the substrate where magnetic shielding is needed, while the laminated film with metal and magnetic layers is applied on the top surface for combined electromagnetic and magnetic shielding. This localized optimization achieves sufficient shielding performance with reduced overall complexity.
3Ease of operation
If holes are formed in the metal casing for component access, then component mounting is enabled, but shielding effect deteriorates due to ground pattern disconnection
Solution Approach 1:
The invention transitions from a three-dimensional metal casing structure to a two-dimensional laminated film structure on the substrate surface. This dimensional change allows the shielding function to be integrated into the circuit board plane, enabling component mounting access without creating holes that would compromise shielding, as the ground patterns remain continuously connected on the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The triple-shield structure effectively reduces electromagnetic wave noise radiation and absorption, providing superior composite shielding while maintaining device height reduction and preventing deterioration of magnetic characteristics by controlling eddy currents, thus enhancing both electromagnetic and magnetic shielding performance.
Implementation Method 1
the magnetic film has a higher effective permeability than that of the magnetic mold resin
Implementation Method 2
the metal film is connected to the power supply pattern
Implementation Method 3
a magnetic mold resin that covers the surface of the substrate so as to embed the electronic component therein and is formed of a composite magnetic material containing a thermosetting resin material and a magnetic filler
Data Source
AI summary
Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a magnetic mold resin that covers the surface of the substrate so as to embed the electronic component therein, the magnetic mold resin comprising a composite magnetic material containing a thermosetting resin material and a magnetic filler; and a laminated film including at least a metal film and a magnetic film, the laminated film covering at least an top surface of the magnetic mold resin. The metal film is connected to the power supply pattern, and the magnetic film has a higher effective permeability than that of the magnetic mold resin.