Circuit Component Package with Copper Bumps and Hermetic Seal
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Solution Overview
Problem
Current surface mount packages for discrete circuit components face challenges such as high costs, poor heat dissipation, and environmental compliance issues, particularly in high-power applications, due to insufficient thermal conductivity and complex packaging processes.
Innovation Solution
A method involving the formation of copper circuits on a single-sided printed circuit board, application of electrically conductive paste, alignment with copper bumps on a copper plate, hermetic sealing, and etching to create terminal electrodes, followed by plated through-holes for electrical connection, simplifying fabrication and improving thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional packaging forms (glass tube/plastic, leaded packages, flat-pack leadless packages) are used, then manufacturing maturity and market dominance are achieved, but heat dissipation performance is insufficient and thermal conductivity is poor
Solution Approach 1:
The patent employs a composite structure combining a copper plate substrate with high thermal conductivity, copper bumps for electrical connection, and a printed circuit board with copper circuits. This composite material approach achieves superior heat dissipation while maintaining manufacturing feasibility through established processes like electroplating, screen printing, and hermetic sealing.
2Volume of moving object
If flip-chip package is used, then light weight and compactness are achieved, but packaging cost is expensive and handling difficulty increases
Solution Approach 1:
The patent segments the packaging structure into distinct functional modules: a copper plate with copper bumps for electrical connection, a printed circuit board with copper circuits for signal routing, and a hermetically sealed cavity housing the circuit dice. This segmentation enables independent optimization of each module and simplifies the assembly process, reducing overall packaging cost while maintaining compactness.
3Adaptability or versatility
If traditional packaging materials and procedures are used, then market dominance is maintained, but environmental compliance with RoHS and WEEE directives becomes difficult
Solution Approach 1:
The patent changes the material parameters by eliminating lead-based solders and hazardous substances from the packaging materials. The copper plate, copper bumps, and conductive pastes are all lead-free and RoHS-compliant. The hermetic sealant and molding compounds are selected to meet WEEE directive requirements, thus achieving environmental compliance while maintaining manufacturing simplicity.
4Productivity
If circuit dice are positioned and connected using conventional methods, then electrical connection is achieved, but production yield and automation capability are limited
Solution Approach 1:
The patent implements self-alignment mechanisms where the circuit dice are positioned on the copper plate with copper bumps, and the electrical connection is automatically established through the conductive paste and hermetic sealing process. The plated through-holes and copper circuits provide automatic electrical routing without requiring complex manual alignment, thereby improving production yield and enabling better automation while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat dissipation, mechanical properties, and electrical characteristics, while reducing manufacturing costs and improving environmental compliance, leading to higher quality and longer-lasting discrete circuit components.
Implementation Method 1
printing an electrically conductive paste on a plurality of predetermined locations on the copper circuits... print the electrically conductive paste on each of the copper bumps
Implementation Method 2
inject a hermetic sealant into the space between the fitted printed circuit board and copper plate
Implementation Method 3
form plated through-holes in one of the terminal electrodes of each package so that the terminal electrode is electrically connected to the circuit dice via the copper circuit
Implementation Method 4
forming copper circuits on a single-sided printed circuit board... form a plurality of surface copper bumps on a copper plate
Data Source
AI summary
A method for manufacturing circuit component package is disclosed. The method first forms copper circuits on a single-sided printed circuit board, and prints an electrically conductive paste on a plurality of predetermined locations on the copper circuits before positioning circuit dice of the circuit components on the locations printed with the electrically conductive paste. The method then forms a plurality of surface copper bumps on a copper plate, and prints the electrically conductive paste on each of the copper bumps. Then position and fit the printed circuit board on which the circuit dice are positioned relative to the copper plate on which the electrically conductive paste is printed such that each of the circuit dice aligns with the corresponding copper bump printed with the electrically conductive paste. Then inject a hermetic sealant into the space between the fitted printed circuit board and copper plate before forming at least two terminal electrodes of each package on a side opposite the copper plate and copper bumps by etching process. Then form plated through-holes in one of the terminal electrodes of each package so that the terminal electrode is electrically connected to the circuit dice via the copper circuit of the single-sided printed circuit board. Finally cut to separate the individual circuit components to form the package.