Circuit Package Internal Monitoring via Interconnected Signal Paths
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Solution Overview
Problem
Current circuit packages lack a redundant monitoring mechanism for integrated circuits and sensors, which limits the ability to verify the functionality of both circuits within a single package without external connections.
Innovation Solution
A circuit package design featuring two monolithic integrated circuits with interconnected signal outputs and inputs, where only one signal output is externally connected, utilizing a contact element and carrier to establish an electrical connection between the circuits, allowing for internal monitoring through redundant comparators and operational amplifiers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If two sensors and integrated circuits are arranged in a single circuit package, then the quantity of components is reduced and space is saved, but the ability to monitor the functionality of both circuits is insufficient without external connections
Solution Approach 1:
The patent combines two separate monitoring functions into a single circuit package. The first integrated circuit monitors the first sensor, and the second integrated circuit monitors the second sensor. Both circuits share common power supply and ground connections within the package, merging multiple functions into one compact unit while maintaining individual monitoring capabilities through internal signal paths.
Solution Approach 2:
The patent implements feedback mechanisms where each integrated circuit receives signals from its corresponding sensor and processes them internally. The circuits are designed to monitor their respective sensors continuously and can detect functional states through internal signal paths, providing ongoing feedback about sensor functionality without requiring external monitoring connections.
2Reliability
If redundant monitoring mechanisms are implemented for both integrated circuits, then the reliability and functionality verification are improved, but the device complexity and number of external connections increase
Solution Approach 1:
The patent merges the monitoring functions of both integrated circuits into a single package with shared power and ground connections. The first and second integrated circuits are arranged to monitor their respective sensors independently while sharing common reference connections, reducing the need for separate external connections for each monitoring function.
Solution Approach 2:
The circuit package is designed with universal power supply and ground connections that serve both integrated circuits simultaneously. The bonding surfaces and electrical connections are configured to provide common references for both monitoring functions, allowing the package to perform multiple monitoring tasks through a unified connection structure rather than requiring separate dedicated connections for each circuit.
Data Source
AI summary
A circuit package having a first semiconductor body with a first monolithic integrated circuit having a first signal output that is interconnected with a bonding surface, and a first signal input that is interconnected with a bonding surface. The circuit package also has a second semiconductor body with a second monolithic integrated circuit having a second signal output that is interconnected with a bonding surface, and a second signal input that is interconnected with a bonding surface. The circuit package further features a contact element with at least one bonding surface, and a carrier element, wherein the bonding surface of the first signal output and the bonding surface of the second signal input are interconnected with the contact element so that an electrical connection exists between the first signal output and the second signal input, and a portion of the contact element penetrates the circuit package.