Circuit Pad Structure for Precise Adhesion Strength Measurement

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Solution Overview

Problem

The challenge in manufacturing semiconductor packages with increased I/O connections is the lack of a suitable method to precisely test the adhesion between circuit layers, which affects the resistance and robustness of the circuit layers.

Innovation Solution

A method involving the formation of a dielectric layer with a first pad and a second pad of greater height, where a force is applied to the second pad along a path overlapping the projecting area of the first pad to test the bonding quality between the pads.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If circuit layers with fine pitch are used to increase I/O connections, then the number of connections and electrical performance are improved, but the adhesion between circuit layer and dielectric layer becomes difficult to test precisely

Engineering Contradiction:

Improvenumber of I/O connectionsVSAvoidadhesion testing precision

Core Design Contradiction:

ProductivityVSMeasurement precision

Solution Approach 1:

The patent divides the circuit layer into multiple segments including a first pad, a second pad, and a circuit trace connecting them. This segmentation allows for independent testing of adhesion at different locations and orientations, enabling precise measurement of bonding strength between the circuit layer and dielectric layer even in fine pitch configurations

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces a protrusion structure as an intermediary element that extends from the second pad. This protrusion serves as a mediator for applying testing forces and measuring adhesion, allowing precise measurement without directly interfering with the fine pitch circuit patterns underneath

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If conventional testing methods are used, then the manufacturing process remains simple, but the bonding quality between circuit layers cannot be precisely measured

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidbonding quality measurement

Core Design Contradiction:

Ease of manufactureVSMeasurement precision

Solution Approach 1:

The patent incorporates testing structures (first pad, second pad, circuit trace, and protrusion) directly into the manufacturing process of the circuit layer. These structures are formed during normal fabrication steps, performing the testing function in advance before final assembly, thus maintaining manufacturing simplicity while enabling precise bonding quality measurement

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The circuit layer serves multiple functions: it provides electrical connections, structural support, and built-in adhesion testing capabilities. The protrusion structure similarly serves both as part of the circuit interconnect and as a testing element, eliminating the need for separate testing structures and maintaining manufacturing simplicity

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS20240170345A1Method of manufacturing circuit pattern structure and measurement method

Publication Date: 2024.05.23 ADVANCED SEMICON ENG INC

AI summary

A method of manufacturing a circuit pattern structure, a measurement method, and a circuit pattern structure are provided. The method of manufacturing the circuit pattern structure includes: forming a dielectric layer; forming at least one first pad at least partially in the dielectric layer; forming a second pad adjacent to the at least one first pad and having a height greater than that of the at least one first pad.