Circuit Pad Assembly With Shared Bonding Paths for Wire Density
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Solution Overview
Problem
The existing wire bonding method for integrated circuits requires a significant number of bonding wires, leading to reduced efficiency and insufficient space utilization, which hinders miniaturization due to long wire bonding distances and direct connections between each pad and a common bonding pad.
Innovation Solution
A circuit structure with a pad assembly and bonding assembly that includes multiple pads connected through a reduced number of bonding wires and metal balls, allowing for series connections and increased distribution density, thereby reducing the number of required bonding wires and improving wire bonding efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If each pad is directly connected to a common bonding pad through individual bonding wires, then reliable electrical connection is achieved, but the number of bonding wires increases significantly and wire bonding efficiency decreases
Solution Approach 1:
The bonding wires are segmented into multiple groups, with each group connecting to a different bonding pad on the circuit board. Instead of all pads connecting to a single common bonding pad, the pads are divided and connected to multiple bonding pads (first bonding pad, second bonding pad, third bonding pad) distributed on the circuit board, reducing the number of wires needed per bonding location.
Solution Approach 2:
The connection architecture transitions from a single-dimension star topology (all pads to one common pad) to a multi-dimension mesh topology where pads are connected to multiple bonding pads distributed across the circuit board in different spatial locations, utilizing two-dimensional or three-dimensional space for wire routing.
2Reliability
If each pad is directly connected to a common bonding pad, then electrical connection is established, but wire bonding distance becomes long and space utilization rate of bonding points decreases
Solution Approach 1:
The single common bonding pad is segmented into multiple bonding pads (first, second, and third bonding pads) positioned at different locations on the circuit board. This segmentation allows bonding wires to connect to nearby bonding pads rather than all wires traveling to a single distant common pad, reducing wire length and improving space utilization.
Solution Approach 2:
Different bonding pads are positioned at different locations on the circuit board to match the spatial distribution of pads on the chip. This local matching optimizes the routing paths, reducing wire bonding distances and improving space utilization in different regions of the bonding area.
3Reliability
If a significant number of bonding wires are used to connect each pad to a common bonding pad, then all pads can be connected, but the number of bonding wires in unit space becomes considerable and miniaturization is hindered
Solution Approach 1:
The bonding wire network is segmented into multiple independent connection paths, with each bonding pad on the circuit board serving as a local connection hub for nearby pads. This segmentation reduces the total number of wires needed compared to a single common pad architecture, as each bonding pad handles only the connections required for its local region.
Solution Approach 2:
Each bonding pad on the circuit board serves multiple functions: it acts as a connection point for multiple pads on the chip, provides electrical connection to the circuit board, and serves as a local routing hub. This multi-functionality reduces the overall complexity of the bonding wire network.
Data Source
AI summary
A circuit structure including a pad assembly, a bonding pad assembly, and a bonding assembly is provided. The pad assembly includes a first pad, a second pad, and a third pad which are separated from one another. The bonding pad assembly is located on one side of the pad assembly and includes a first bonding pad. The bonding assembly includes a first bonding wire, a second bonding wire, and a plurality of bonding members. The first bonding wire is connected to the first bonding pad and the first pad. The second bonding wire is connected to the first bonding pad and the third pad. The bonding members are connected among the first pad, the second pad, and the third pad. The circuit structure provided here may have an improved wire bonding efficiency and an increased distribution density of bonding points, and the number of bonding wires may be reduced.