Co-support Circuit Panel Symmetric Contact Arrangement
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Solution Overview
Problem
Conventional microelectronic assemblies face challenges in achieving compact physical arrangements and functional flexibility, particularly in interconnecting semiconductor chips with numerous input and output connections, which often result in increased assembly size and limited compatibility between different types of microelectronic packages.
Innovation Solution
A microelectronic assembly design featuring a circuit panel with symmetrically arranged contacts and buses that can accommodate multiple microelectronic packages, allowing for efficient interconnection and address signal handling, including command and address signals, while maintaining a compact footprint and compatibility with various memory storage arrays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional chip packages are used with all terminals placed in sets of columns adjacent to peripheral edges, then the package structure is simple and easy to manufacture, but the assembly size increases and functional flexibility is limited
Solution Approach 1:
The patent applies asymmetry by dividing terminals into first terminals (connected to active elements) and second terminals (not connected to active elements), with different signal assignment patterns. This asymmetric configuration enables the circuit panel to accommodate different types of microelectronic packages with varying terminal requirements, improving functional flexibility while maintaining compact assembly size through optimized terminal placement and sharing.
2Adaptability or versatility
If multiple sets of contacts are used to accommodate different microelectronic package types, then compatibility with different package types is achieved, but the circuit panel complexity increases
Solution Approach 1:
The patent implements universality by designing a circuit panel where the same physical contacts can serve multiple functions depending on the connected package type. The controller dynamically assigns signal meanings to contacts based on detection results, allowing a single circuit panel structure to support both first type packages (with active elements at all terminals) and second type packages (with active elements at only some terminals), thereby achieving multi-package compatibility without increasing physical complexity.
Solution Approach 2:
The patent applies dynamics through the controller's ability to dynamically reconfigure signal assignments based on the detected package type. The signal assignment is not fixed but adapts in real-time according to which microelectronic package is connected, enabling the system to optimize its configuration for the specific package type in use and reducing the need for multiple dedicated contact sets.
3Ease of manufacture
If symmetric contact arrangements are used, then signal routing is simplified, but the ability to handle different signal assignments for different package types is reduced
Solution Approach 1:
The patent resolves this contradiction by making the signal assignment dynamic rather than fixed. While the physical contact arrangement remains symmetric and simple for manufacturing, the controller dynamically assigns different signal meanings to the same contacts depending on the detected package type. This allows the system to maintain manufacturing simplicity while achieving signal assignment flexibility through software-controlled reconfiguration.
Data Source
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Figure 2B
AI summary
A circuit panel 720 can include contacts 760 exposed at a connection site 761 of a major surface 721 thereof and configured to be coupled to terminals 504 of a microelectronic package 500. The connection site 761 can define a peripheral boundary 764 on the major surface 721 surrounding a group of the contacts 760 that is configured to be coupled to a single microelectronic package 500. The group of contacts 760 can include first, second, third, and fourth sets AO, AO', Al ', Al of first contacts 704. Signal assignments of the first and third sets AO, Al ' of first contacts can be symmetric about a theoretical plane 532 normal to the major surface 721 with signal assignments of the respective second and fourth sets AO ', Al of first contacts. Each of the sets AO, AO', Al ', Al of first contacts 704 can be configured to carry identical signals.