Release-Sheet Circuit Pattern Transfer for Plating and Clean Peeling
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Solution Overview
Problem
The existing method for producing circuit patterns experiences issues with plating erosion at the boundary between the circuit pattern and the release sheet due to hydrogen gas generation, leading to peeling and disruption of the intended conductor pattern during the peeling process.
Innovation Solution
A method involving plating a metal plate, bonding a release sheet to its back surface, applying a resist pattern, and etching to form a circuit pattern bonded to the release sheet, followed by transferring and peeling off the pattern from the release sheet to an insulating layer on a base substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a release sheet with high initial adhesive force is used to bond to the metal plate, then plating erosion is suppressed and Ni/Au erosion is prevented, but the release sheet becomes difficult to peel off after ultraviolet irradiation
Solution Approach 1:
The patent segments the adhesive bonding process into two distinct phases: initial bonding with high adhesive force to prevent plating erosion, and subsequent release with reduced adhesive force through ultraviolet irradiation. This segmentation allows the release sheet to serve dual functions effectively.
Solution Approach 2:
The patent changes the adhesive force parameter of the release sheet by exposing it to ultraviolet light. The ultraviolet irradiation modifies the chemical or physical properties of the adhesive layer, transitioning it from a high-adhesive state during plating to a low-adhesive state for easy peeling after etching.
2Ease of operation
If a release sheet with low adhesive force is used, then easy peeling is achieved, but plating erosion occurs and Ni or Au is damaged
Solution Approach 1:
The patent applies preliminary action by bonding the release sheet to the metal plate before the plating process. The release sheet is positioned and secured in advance, ensuring proper alignment and preventing plating erosion during the subsequent plating and etching operations.
Solution Approach 2:
The adhesive force parameter is dynamically changed through ultraviolet irradiation applied after etching. This parameter change transforms the release sheet from a high-adhesive state that prevents plating erosion to a low-adhesive state that enables easy peeling without damaging the circuit pattern.
3Productivity
If hydrogen gas is generated during Ni plating, then plating process is completed, but the release sheet peels off and causes erosion of Ni or Au
Solution Approach 1:
The patent applies beforehand cushioning by ensuring the release sheet is firmly bonded to the metal plate before the plating process begins. This pre-bonding creates a protective cushion that prevents hydrogen gas-induced peeling and subsequent circuit pattern erosion during the Ni plating step.
Solution Approach 2:
The patent controls the adhesive force parameter through timed ultraviolet irradiation applied only after etching is complete. This parameter change ensures the release sheet remains firmly attached during plating (preventing erosion) but can be easily removed after etching (enabling pattern transfer).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables satisfactory plating and easy peeling of the circuit pattern from the release sheet without disrupting the conductor pattern's positional relationship, enhancing production efficiency and reducing material erosion.
Implementation Method 1
the UV sheet can be easily peeled off from the bonded object by irradiating the UV sheet with ultraviolet rays at the time of peeling off the UV sheet
Implementation Method 2
When exposure is performed, the dry film 103 is cured in a portion where light passes through an opening of the exposure film 104
Implementation Method 3
when etching is performed, as illustrated in Fig. 6D, the metal plate 101 is dissolved so as to penetrate in the thickness direction at the portion where the opening of the resist pattern 105 is provided
Implementation Method 4
electroless Ni-P/Au plating is applied to the circuit pattern 106, whereby a plating film (electroless Ni-P/Au plating film 107) is provided on the exposed surface
Implementation Method 5
hydrogen gas was generated in a Ni plating step, and this hydrogen gas peeled the release sheet 102 from the circuit pattern 106
Data Source
Figure 1A~1C
Figure 2A~2E
Figure 3A~3E
AI summary
Provided is a method for producing a circuit pattern, the method capable of satisfactorily plating a circuit pattern bonded to a release sheet and satisfactorily peeling the plated circuit pattern from the release sheet. The method for producing a circuit pattern includes: a step of plating a predetermined portion on a surface of a metal plate (11); a step of bonding a release sheet (14) to a back surface of the plated metal plate (11); a step of providing a resist pattern (17) covering the plating on the surface of the metal plate (11); and a step of forming a circuit pattern (2) bonded to the release sheet (14) by etching the metal plate (11) provided with the resist pattern (17).