Circuit Pattern Splitting via Image Log-Slope Analysis
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Solution Overview
Problem
Current methods for splitting complex circuit patterns into less complex masks for double-patterning exposure are complex and often fail to resolve conflicts, requiring manual intervention and being inefficient.
Innovation Solution
A method that uses image log-slope (ILS) analysis to identify and separate non-properly printed edges, applying topological criteria to determine which edges can be separated into separate masks, thereby resolving conflicts and optimizing the splitting process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If current methods are used to split complex circuit patterns into masks, then the splitting process can be performed, but the process is complex, fails to resolve conflicts, and requires manual intervention
Solution Approach 1:
The patent transforms the complex pattern splitting problem into a mathematical optimization problem by defining an energy function based on ILS values. By changing the approach from rule-based manual splitting to parameter-driven automated optimization, the system resolves conflicts automatically and achieves high程度的 automation while reducing process complexity.
Solution Approach 2:
The system performs self-service by automatically identifying non-properly printed edges through ILS analysis, determining optimal split locations, and resolving conflicts without manual intervention. The automated algorithm independently completes the entire pattern splitting process, eliminating the need for operator involvement.
2Manufacturing precision
If complex circuit patterns are split into multiple masks, then printing resolution is improved, but the process requires manual intervention and is inefficient
Solution Approach 1:
The patent replaces manual mechanical analysis and decision-making with an automated computational system. The energy function-based algorithm automatically evaluates all possible split configurations and selects the optimal solution, achieving both high printing precision through ILS optimization and high productivity through automation.
Solution Approach 2:
The system performs preliminary analysis by calculating ILS values for all edges before performing the actual split. This pre-computation of printing quality metrics allows the algorithm to make informed decisions about optimal split locations, ensuring both high resolution and efficient processing.
3Reliability
If manual methods are used for pattern splitting, then conflicts can be identified, but the process is complex and time-consuming
Solution Approach 1:
The patent implements feedback through the energy function that continuously evaluates split configurations based on ILS values. The system iteratively adjusts split locations to minimize the energy function, ensuring conflicts are properly resolved while automatically optimizing printing quality, thereby achieving reliable conflict resolution without time-consuming manual analysis.
Data Source
AI summary
A method for separating an original circuit pattern to be printed on a wafer, into multiple circuit patterns is disclosed. Simulation to obtain an image log-slope (ILS), normalized image log-slope (NILS), or any other characteristic of an image quality on edges of polygons in the circuit pattern obtained from circuit pattern data is performed. Properly printed edges and not-properly printed edges are identified according to a criterion of an ILS level. The original circuit pattern is separated into multiple circuit patterns such that each of the multiple patterns does not have any not-properly printed edges.