3D Model Overlay for Circuit Probing Target Identification
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Solution Overview
Problem
The process of identifying a probing target for an electronic circuit is laborious and time-consuming, often resulting in incorrect probing due to the multi-step process of identifying network nodes in schematics, layouts, and verifying operations.
Innovation Solution
A system that automates the process by generating a three-dimensional model of the circuit from manufacturing layout information, using a vision system to correlate this model with the physical environment, and indicating a probing target through visual or augmented reality displays, ensuring accurate identification of probing points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a multi-step manual process is used to identify probing targets (identifying network node in schematic, locating on PCB layout, verifying operations), then probing accuracy can be achieved, but the process becomes laborious and time-consuming
Solution Approach 1:
The patent creates a digital twin (three-dimensional model) that copies the physical circuit board's geometry and network node locations. This virtual model allows operators to identify and plan probing points without physically searching the circuit board, significantly reducing time while maintaining accuracy through precise digital-physical correspondence.
Solution Approach 2:
The system performs preliminary identification of probing targets by overlaying the three-dimensional model with the physical circuit board before actual probing begins. Network nodes and accessible probing points are pre-identified and marked in the visual display, eliminating the need for time-consuming manual search and verification during the probing process.
2Ease of operation
If a multi-step manual process is used to identify probing targets, then probing can be performed, but the process is complex and error-prone
Solution Approach 1:
The patent merges the schematic diagram information, PCB layout data, and three-dimensional visual representation into a single integrated system. The overlay technique combines multiple data sources (manufacturing layout information, visual environment information) into one unified display, simplifying the operator's task while reducing errors from manual translation between different representations.
Solution Approach 2:
The three-dimensional model acts as an intermediary between the abstract schematic diagrams and the physical circuit board. It serves as a virtual bridge that translates design information into spatial coordinates on the actual board, making the identification process more intuitive and less error-prone.
3Extent of automation
If traditional methods are used to identify probing points, then manual verification is possible, but automation is limited
Solution Approach 1:
The system uses vision systems to capture images of the physical circuit board and compares them with the three-dimensional model in real-time. This feedback loop automatically verifies that the identified probing points on the digital model correspond to actual accessible points on the physical board, maintaining high accuracy while enabling automation.
Solution Approach 2:
The patent replaces manual visual inspection and physical verification with automated vision systems and computer-generated three-dimensional models. The system automatically processes manufacturing layout information and real-time images to identify probing points, eliminating manual labor while preserving accuracy through algorithmic precision.
Data Source
AI summary
A method for indicating a probing target for a fabricated electronic circuit including: generating an electronic, three-dimensional model based on manufacturing layout information of a fabricated circuit; obtaining, with a vision system, visual environment information for the fabricated circuit; scaling and orienting the three-dimensional model by a scaler and mapper based on the visual environment information; overlaying the three-dimensional model with the visual environment information to produce a correlated image; obtaining an identification of a desired network node of the fabricated circuit; and indicating a probing target, the probing target corresponding to the desired network node of the fabricated circuit.