Metal Circuit Pattern Protrusions for Brazing Alignment
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Solution Overview
Problem
In semiconductor device brazing, misalignment of the brazing material between the insulating substrate and the metal terminal is a persistent issue, affecting the bonding quality.
Innovation Solution
The introduction of protrusions on the metal circuit pattern, which come into contact with the hard brazing material, helps to suppress misalignment by ensuring the brazing material is accurately positioned during the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If brazing is performed between the insulating substrate and the metal terminal, then the bonding strength is improved, but the position alignment of the brazing material deteriorates
Solution Approach 1:
Protrusions are formed on the metal circuit pattern before the brazing process. These protrusions serve as preliminary positioning features that guide and constrain the brazing material during bonding, ensuring accurate alignment between the metal terminal and the circuit pattern while maintaining strong bonding.
2Ease of manufacture
If the brazing material is applied freely between the insulating substrate and the metal terminal, then the ease of manufacture is improved, but the alignment precision of the brazing material deteriorates
Solution Approach 1:
The protrusions on the metal circuit pattern act as intermediary positioning features between the brazing material and the metal terminal. These protrusions provide physical contact points that guide the brazing material into the correct position, simplifying the application process while ensuring precise alignment without requiring complex positioning mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The presence of protrusions stabilizes the bonding quality by preventing misalignment of the brazing material, resulting in improved bonding between the metal terminal and the metal circuit pattern.
Implementation Method 1
brazing is performed in some cases in order to firmly bond an insulating substrate with a metal circuit pattern formed on the surface of an insulating layer and a metal terminal
Data Source
AI summary
Provided is a semiconductor device capable of suppressing misalignment of a brazing material when bonding a metal terminal to a metal circuit pattern. The semiconductor device includes an insulating substrate with a metal circuit pattern formed in a surface thereof and a metal terminal bonded onto the metal circuit pattern via a hard brazing material, in which protrusions are provided on the metal circuit pattern, and the protrusions are in contact with the hard brazing material.