Circuit Signal Connection Interface for COG Packages
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Solution Overview
Problem
Conventional chip on glass (COG) package methods face challenges in signal transmission quality due to reduced contact area sizes, which are necessary for smaller system sizes and improved image quality.
Innovation Solution
A circuit signal connection interface is designed with a first and second signal line disposed in parallel, an insulation layer covering part of the second signal line, and a conductive pad with portions on either side of the signal lines, preventing direct contact and enhancing the electrical contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the contact area size is reduced to decrease system size, then the system size is reduced, but the signal transmission quality deteriorates
Solution Approach 1:
The conductive pad is designed to extend in the vertical dimension (Z-axis) to form a protruding structure that overlaps with the signal line. This three-dimensional configuration increases the contact area without expanding the planar footprint (X-Y plane), thereby reducing system size while maintaining or improving signal transmission quality through enhanced electrical contact.
Solution Approach 2:
The conductive pad is divided into multiple portions (first portion, second portion, third portion) that can be positioned at different locations relative to the signal line. This segmentation allows the pad to wrap around or overlap with the signal line from multiple sides, effectively increasing the contact area and improving signal transmission while maintaining a compact layout.
2Measurement precision
If the contact area size is reduced to improve image quality, then the image quality is improved, but the signal transmission quality deteriorates
Solution Approach 1:
By extending the conductive pad in the vertical dimension to create an overlapping configuration with the signal line, the invention increases the electrical contact area without increasing the planar contact footprint. This allows for smaller contact areas on the surface level (improving image quality by reducing interference) while maintaining robust signal transmission through the enhanced three-dimensional contact structure.
3Reliability
If the conductive pad is positioned to increase contact area, then the signal transmission quality is improved, but the device complexity increases
Solution Approach 1:
The conductive pad is merged with the insulation layer to form an integrated structure. The pad extends through or overlaps with the insulation layer, combining the functions of electrical conduction and electrical isolation in a single integrated component. This reduces device complexity by eliminating the need for separate structures while maintaining improved signal transmission quality through increased contact area.
Data Source
AI summary
A circuit signal connection interface, a manufacturing method thereof, and an electronic device using the same are provided. The circuit signal connection interface includes a first signal line and a second signal line juxtaposed to each other, an insulation layer, and a first conductive pad. The first conductive pad electrically connects to the first signal line, and crosses the second signal line. Te insulation layer is disposed between the second signal line and the first conductive pad. The electronic device further includes a circuit device including a first conducting bump and a second conducting bump connected to each other in a parallel manner. The first conducting bump electrically connects to a first portion of the first conductive pad while the second conducting bump electrically connects to a second portion of the first conductive pad.