Circuit Substrate With Simultaneous Conductive Block Formation
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Solution Overview
Problem
Current semiconductor package technologies face challenges in simplifying the fabrication process and optimizing space usage on circuit substrates as the density of circuits increases, requiring more efficient methods to deploy circuits in limited spaces.
Innovation Solution
The proposed circuit substrate design includes a base layer, patterned conductive layers, dielectric layers, and conductive blocks, where the conductive blocks and patterned conductive layers are formed simultaneously, improving alignment accuracy and increasing circuit integration by allowing for more compact layout without separate alignment steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate alignment steps are used to form conductive blocks and patterned conductive layers, then manufacturing flexibility is maintained, but alignment accuracy deteriorates and fabrication process becomes more complex
Solution Approach 1:
The patent merges the formation of conductive blocks and patterned conductive layers into a single simultaneous fabrication process. The conductive block and second patterned conductive layer are formed in one step, eliminating the need for separate alignment steps and improving alignment accuracy while reducing process complexity.
Solution Approach 2:
The patent employs preliminary action by forming the conductive block and patterned conductive layer simultaneously in advance, before subsequent processing steps. This simultaneous formation ensures precise alignment is achieved during the initial fabrication rather than requiring later alignment adjustments.
2Productivity
If circuit density is increased to optimize space usage, then circuit integration is improved, but fabrication process becomes more difficult
Solution Approach 1:
By combining the formation of multiple conductive structures into a single simultaneous process, the patent simplifies fabrication while enabling higher circuit density. The merged process reduces the number of steps required, making it easier to manufacture high-density circuits without proportionally increasing manufacturing difficulty.
Data Source
AI summary
A circuit substrate includes a base layer, a first patterned conductive layer, a dielectric layer, a conductive block and a second patterned conductive layer. The first patterned conductive layer is disposed on the base layer and has a first pad. The dielectric layer is disposed on the base layer and covers the first patterned conductive layer, wherein the dielectric layer has an opening and the first pad is exposed by the opening. The conductive block is disposed in the opening and covers the first pad. The second patterned conductive layer is disposed on a surface of the dielectric layer and has a second pad, wherein the second pad and the conductive block are integrally formed.