Circuit Substrate With Dummy Wire For Field Intensity Reduction
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Solution Overview
Problem
Conventional thin-film resistive elements experience significant temporal changes in resistance values due to increased field intensity near high-potential electrodes, leading to reduced product life.
Innovation Solution
A circuit substrate with a thin-film resistive element featuring a repeated fold-back pattern and a dummy wire on the high-potential electrode side to reduce field intensity, where the dummy wire can be continuous or branch off from the resistance wire, effectively alleviating potential decrease and field intensity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional thin-film resistive element with a fold-back pattern is used, then the resistance value can be maintained, but the field intensity near the high-potential electrode increases causing large temporal changes in resistance value and reduced product life
Solution Approach 1:
A dummy wire is introduced as an intermediary conductive element between the high-potential electrode and the fold-back pattern. This dummy wire acts as a field-shielding mediator that redistributes the electric field intensity, preventing excessive field concentration at the electrode-resistance wire interface while maintaining the electrical functionality of the original resistive element.
Solution Approach 2:
The dummy wire is designed to preemptively counteract the harmful high field intensity before it can cause damage to the thin-film resistive element. By placing the dummy wire in proximity to the high-potential electrode, the electric field is redistributed in advance, preventing the temporal changes in resistance value that would otherwise occur during product operation.
2Reliability
If the dummy wire is added to reduce field intensity, then the product life is extended, but the device complexity increases
Solution Approach 1:
The dummy wire is merged with the existing fold-back pattern structure, forming an integrated conductive configuration. Rather than being a completely separate component, the dummy wire is seamlessly incorporated into the thin-film resistive element's geometry, sharing common fabrication processes and reducing overall device complexity while still providing the field-intensity reduction function.
Data Source
AI summary
Particularly, it is an object to provide a circuit substrate that can reduce a field intensity near an electrode having a high potential. A circuit substrate of the present invention includes an insulated substrate, a thin-film resistive element, and electrodes electrically connected to both sides of the thin-film resistive element, the thin-film resistive element and the electrodes being disposed on a surface of the insulated substrate. The circuit substrate is characterized in that the thin-film resistive element has a pattern in which a resistance wire is repeatedly folded back, and a dummy wire for reducing a field intensity is provided on a high-potential electrode side.