Circuit Substrate Corner Impedance Matching via Extending Portion
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Solution Overview
Problem
Conventional circuit substrates with conductive vias often experience impedance mismatching at corner portions due to inadequate design for adaptive impedance matching between inner and outer conductive vias and signal circuits.
Innovation Solution
The proposed circuit substrate design includes a dielectric layer with a first conductive structure and a second conductive structure, where the second conductive structure features an extending portion that protrudes towards the first conductive via without contact, and an opening portion directed away from the first conductive via, allowing for adaptive impedance control and prevention of signal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional design with adaptive impedance matching distances is used between inner conductive via and outer conductive via, then impedance matching between vias is improved, but impedance mismatching still occurs at corner portions
Solution Approach 1:
The patent applies local quality by introducing an extending portion specifically at the corner portion where the second conductive structure meets the first conductive circuit. This extending portion locally modifies the geometry to improve impedance matching at the problematic corner area, rather than uniformly adjusting the entire structure. The extending portion creates a gradual transition that eliminates the sharp corner discontinuity, thereby resolving the impedance mismatching issue at this specific location.
Solution Approach 2:
The patent introduces an extending portion that protrudes from the second conductive structure toward the first conductive via, adding a dimensional element to the corner portion design. This extending portion creates a three-dimensional configuration that provides a more gradual impedance transition, effectively bridging the impedance difference between the inner and outer conductive structures at the corner area.
2Ease of manufacture
If corner portions are provided at junctions of conductive vias and circuits for conventional layout, then manufacturing is simplified, but impedance mismatching and signal interference occur
Solution Approach 1:
The extending portion is introduced specifically at the corner portion junction, making a localized modification to the otherwise simple conventional layout. This local modification maintains the overall manufacturing simplicity while addressing the impedance matching issue only where it is needed, without requiring complete redesign of the entire circuit layout.
Data Source
AI summary
A circuit substrate includes a dielectric layer, a first conductive structure and a second conductive structure. The first conductive structure includes a first conductive circuit and a first conductive via. The first conductive circuit is disposed on the dielectric layer. The first conductive via is disposed in the dielectric layer, and the first conductive circuit is connected to the first conductive via. The second conductive structure includes a second conductive circuit and a second conductive via. The second conductive circuit is disposed in the dielectric layer, the second conductive circuit and the first conductive circuit of the first conductive structure are arranged with an interval, and the second conductive via surrounds the first conductive via with an interval. The second conductive structure has an extending portion. The extending portion protrudes toward the first conductive via and does not contact the first conductive via.