Circuit Substrate Layout for Ink Cartridge Terminal Protection
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Solution Overview
Problem
The existing method of thermally caulking the circuit substrate to an ink cartridge can damage device-side terminals due to contact with caulk heads, and increasing the size of the circuit substrate to avoid this contact is costly.
Innovation Solution
A circuit substrate design with strategically positioned openings and protrusions allows for reliable electrical contact between device-side terminals and electrodes without increasing the substrate size, using thermally caulking protrusions that avoid the terminal path during cartridge insertion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuit substrate is thermally caulked using conventional protrusion positions, then the circuit substrate is securely fixed to the ink cartridge, but the device-side terminals are damaged by contact with the caulk heads during cartridge insertion
Solution Approach 1:
The patent segments the substrate surface into distinct functional zones: a first region for electrode mounting, a second region for caulking operations, and a third region serving as a protective buffer zone. This spatial segmentation allows the caulk heads to operate in the second region while the electrodes remain protected in the first region, preventing terminal damage while maintaining secure fixation.
Solution Approach 2:
The patent applies local quality by creating a buffer zone (third region) with specific structural characteristics that differ from other areas. This buffer zone acts as a protective barrier with optimized properties to absorb or redirect the caulk heads, providing localized protection to the electrode-containing first region while maintaining overall substrate integrity.
2Object-affected harmful factors
If the circuit substrate size is increased to avoid contact between caulk heads and device-side terminals, then terminal damage is prevented, but the manufacturing cost increases
Solution Approach 1:
The patent resolves the contradiction by transitioning from a size-based solution to a layout-based solution. Instead of increasing substrate dimensions, the invention optimizes the two-dimensional arrangement of regions and features, positioning the buffer zone and electrodes in specific spatial relationships that prevent terminal damage while maintaining compact substrate size and cost-effectiveness.
Solution Approach 2:
The patent introduces dynamic spatial relationships where the buffer zone adaptively manages the interaction between caulk heads and electrodes during the insertion process. The buffer zone's position and dimensions are designed to dynamically accommodate the caulking operation while maintaining protective separation, allowing effective terminal protection without excessive substrate size increase.
3Object-affected harmful factors
If the buffer zone is positioned between the electrode and the caulking region, then the device-side terminals are protected from damage, but the substrate layout becomes more complex
Solution Approach 1:
The patent manages layout complexity through systematic segmentation into three clearly defined regions with specific functional assignments. This structured segmentation provides a straightforward design framework that simplifies the overall layout planning process, making the buffer zone's protective function achievable without excessive complexity.
Solution Approach 2:
The patent applies preliminary action by pre-positioning the buffer zone in the substrate design before the caulking operation occurs. This advance placement of the protective buffer zone eliminates the need for complex real-time adjustments or complex interaction mechanisms during insertion, simplifying the overall substrate layout while ensuring terminal protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures reliable contact between device-side terminals and electrodes without damaging the terminals and maintains a compact substrate size, preventing costly size increases.
Implementation Method 1
The circuit substrate is fixed to the cartridge by thermally caulking the protrusions
Data Source
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AI summary
A circuit substrate includes: a substrate body and an electrode. The substrate body has four sides including first and second sides extending in a first direction and opposing each other in a second direction. The substrate body has a top surface on which the electrode is mounted. The electrode has first and second outer points positioned closest to the first and second sides in the second direction respectively. The top surface has: a first area between the first side and a first imaginary line extending in the first direction and passing through the first outer point; a second area between the second side and a second imaginary line extending in the first direction and passing through the second outer point; and a third area interposed between the first area and the second area in the second direction, the substrate body being formed with a first opening in the first area.