Circuit Substrate Thermal Management via Metal Block Conduction
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Solution Overview
Problem
Circuit substrates face challenges in effectively managing heat dissipation and temperature control for electronic components accommodated in cavities, leading to potential malfunctions due to high temperatures.
Innovation Solution
A circuit substrate design featuring a core substrate with a cavity, a combined component of an electronic component and a metal block, and build-up layers with insulating resin, where the metal block's rough surface and filling resin enhance thermal conductivity and fixation, allowing efficient heat dissipation through the metal block to the motherboard.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If an electronic component is accommodated in a cavity of a core substrate, then the device complexity is reduced and integration is improved, but heat dissipation becomes insufficient leading to temperature rise
Solution Approach 1:
A metal block is introduced as an intermediary thermal conduction member between the electronic component and the core substrate. The metal block has a thermal conductivity of 10 W/(m·K) or more, which is significantly higher than typical substrate materials, thereby efficiently conducting heat away from the electronic component to the motherboard without increasing device complexity
Solution Approach 2:
The patent uses a composite structure combining the metal block with the core substrate and build-up layers. The metal block is embedded in the core substrate cavity and thermally coupled to the electronic component, creating a hybrid thermal management system that leverages the high thermal conductivity of metal while maintaining the structural integrity of the substrate composite
2Reliability
If a metal block is added to the combined component, then thermal conductivity is improved for heat dissipation, but the device complexity increases
Solution Approach 1:
The metal block is merged with the electronic component to form a combined component assembly. This integration allows the thermal management function to be incorporated directly into the component structure itself, reducing the need for separate heat sinks or thermal management devices that would increase complexity
3Stability of the object's composition
If filling resin is used to fill the gap between the cavity and the combined component, then the fixation stability is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The filling resin undergoes a parameter change from liquid to solid state through curing. This phase transition allows the resin to initially flow into and fill irregular gaps between the cavity and combined component, then solidify to provide stable fixation, thereby reducing the stringency of manufacturing precision requirements for gap uniformity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses temperature rise in electronic components by facilitating heat transfer from both the electronic component and the CPU to the motherboard, stabilizing the metal block's fixation and improving heat transmission efficiency.
Implementation Method 1
the metal block's rough surface and filling resin enhance thermal conductivity and fixation, allowing efficient heat dissipation through the metal block to the motherboard
Implementation Method 2
a filling resin filling a gap formed between the cavity and the combined component accommodated in the cavity of the core substrate
Data Source
AI summary
A circuit substrate includes a core substrate having a cavity penetrating through the substrate, a combined component accommodated in the cavity of the substrate, a first build-up layer laminated on first surface of the substrate and including an insulating layer such that the insulating layer is covering the cavity, a second build-up layer laminated on second surface of the substrate and including an insulating layer such that the insulating layer is covering the cavity, and a filling resin filling gap formed between the cavity and combined component accommodated in the cavity of the substrate. The combined component includes an electronic component and a metal block, the electronic component has terminal surface on side facing the first surface of the substrate, and the metal block is superposed to surface of the electronic component on the opposite side of the electronic component with respect to the terminal surface.