Circuit Substrate Manufacturing via Peripheral Metal Bonding
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Solution Overview
Problem
The existing methods for manufacturing multi-layer circuit substrates, such as laminated and build-up processes, face challenges in reducing time consumption and enhancing reliability due to warping issues and high production costs, especially in mass production.
Innovation Solution
A method involving bonding the peripheries of two metal layers to form a sealed area, embedding them between insulating and conductive layers, and separating them to create double-sided or triple-sided circuit substrates, which includes forming blind holes and filling them with conductive material, using processes like electric welding, laser ablation, and electroplating to enhance bonding and patterning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If the laminated process is performed on a single side, then the manufacturing time is reduced, but the circuit substrate warps and reliability is reduced
Solution Approach 1:
The manufacturing process is segmented into two sides: a first side where metal layers are formed and laminated, and a second side where additional metal layers are formed and laminated. This segmentation allows both sides to be processed simultaneously or in parallel, reducing total manufacturing time while maintaining structural balance to prevent warping.
Solution Approach 2:
The invention transitions from single-sided lamination to double-sided lamination, adding a dimensional aspect to the manufacturing process. By forming and laminating metal layers on both the first and second sides of the insulating layer, the process achieves faster production without compromising substrate flatness or reliability.
2Adaptability or versatility
If the build up process is used to form odd or even circuit layers, then manufacturing flexibility is improved, but position accuracy requirements increase and time consumption increases leading to higher cost
Solution Approach 1:
Metal layers are formed on both sides of the insulating layer before the lamination process. This preliminary formation of conductive structures on both sides enables flexible circuit layer configurations (odd or even layers) to be achieved while maintaining efficient mass production capabilities and reducing overall manufacturing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces manufacturing time and enhances the reliability of circuit substrates by preventing warping and allowing for efficient production of both odd and even layer configurations, improving the overall manufacturing process.
Implementation Method 1
the method for bonding the peripheries of the two metal layers includes an electric welding process
Implementation Method 2
using processes like electric welding, laser ablation, and electroplating
Implementation Method 3
using processes like electric welding, laser ablation, and electroplating
Data Source
AI summary
A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. Two insulating layers are formed on the two metal layers. Two including upper and bottom conductive layers are formed on the two insulating layers. Then, the two insulating layers and the two conductive layers are laminated so that the two metal layers bonded to each other are embedded between the two insulating layers. A part of the two insulating layers and a part of the two conductive layers are removed to form a plurality of blind holes exposing the two metal layers. A conductive material is formed in the blind holes and on the remained two conductive layers. The sealed area of the two metal layers is separated to form two separated circuit substrates.