Protective Circuit Substrate Heat Dissipation Segmentation
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Solution Overview
Problem
The existing protective circuit substrates for lithium ion secondary batteries face challenges in heat dissipation, which can inhibit the high-speed blowout property of the meltable conductor during abnormal conditions like over-charging or over-discharging, as heat generated by the heat-generating element is dissipated to the circuit substrate and surroundings, reducing the effectiveness of interrupting the current path.
Innovation Solution
A protective circuit substrate design with a minimized area of electrode patterns having large heat capacity beneath the protective element, where the heat-generating element's heat is efficiently conducted to the meltable conductor by using a circuit substrate with connecting electrodes only necessary for mounting, thereby suppressing heat dissipation and ensuring prompt melting of the meltable conductor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If electrode patterns with large heat capacity are provided on the circuit substrate to suppress heat generated by the protective element, then heat dissipation is improved, but the heat-generating element cannot efficiently transfer heat to the meltable conductor, degrading the blowout speed
Solution Approach 1:
The circuit substrate is divided into a mounting region with minimized electrode patterns and a heat dissipation region with extended electrode patterns. This segmentation allows the mounting region to minimize heat absorption from the heat-generating element while the heat dissipation region handles overall thermal management, resolving the contradiction between heat dissipation and blowout speed.
Solution Approach 2:
Different regions of the circuit substrate are assigned different thermal properties: the mounting region has minimized electrode patterns to reduce heat absorption and maintain high blowout speed, while the heat dissipation region has extended electrode patterns to handle overall heat dissipation. This local differentiation resolves the contradiction by optimizing each region for its specific function.
2Speed
If the area of electrode patterns beneath the protective element is minimized, then heat transfer to the meltable conductor is improved, but the heat dissipation capability of the circuit substrate is reduced
Solution Approach 1:
The circuit substrate is segmented into a mounting region with minimized electrode patterns for efficient heat transfer to the meltable conductor, and a heat dissipation region with extended electrode patterns for overall heat dissipation. This segmentation allows both requirements to be satisfied simultaneously in different spatial zones.
Solution Approach 2:
The solution moves from a two-dimensional minimization problem to a three-dimensional spatial distribution by creating distinct regions on the circuit substrate. The electrode patterns are strategically distributed across different areas (mounting region vs. heat dissipation region) to achieve both fast heat transfer and effective heat dissipation.
3Temperature
If dummy electrode patterns are provided to increase heat capacity, then heat dissipation is enhanced, but the complexity of the circuit substrate design increases
Solution Approach 1:
The electrode patterns in the heat dissipation region serve dual functions: they provide heat capacity for thermal management and maintain electrical connectivity for signal transmission. This multi-functionality eliminates the need for separate dummy electrode patterns, reducing design complexity while achieving heat dissipation enhancement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the high-speed blowout property of the meltable conductor, allowing for effective interruption of the current path during abnormalities by minimizing heat dissipation and ensuring efficient heat transfer to the meltable conductor, thus preventing accidents like fires.
Implementation Method 1
heat of the heat-generating element 14 should be preferentially conducted to the meltable conductor 13 so that protective element 3 can promptly blow the meltable conductor 13
Implementation Method 2
heat of the heat-generating element 14 should be preferentially conducted to the meltable conductor 13
Implementation Method 3
meltable conductor 13...for interrupting the current path between the first electrode and the second electrode by being melted by heat
Data Source
AI summary
In a protective circuit substrate having a circuit substrate and a protective element, the protective element including: an insulating substrate; a heat-generating element; first and second electrodes laminated on the insulating substrate; a first and second connecting terminals provided on one side edge of a mounting surface to be mounted to the circuit substrate, the first connecting terminals being continuous with the first and second electrodes; a heat-generating element extracting electrode provided in a current path between the first and second electrodes and electrically connected to the heat-generating element; and a meltable conductor provided between the first and second electrodes, wherein the circuit substrate includes a region for mounting the protective element in which no electrode pattern other than a connecting electrode to the protective element is provided.