Thermal Management for Circuit Substrates Using Conductive Layers
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Solution Overview
Problem
Existing cooling solutions for electronic components, particularly in stacked circuit substrates with limited space, fail to provide adequate cooling due to restricted air flow and occupy excessive volume, especially for double-sided substrates.
Innovation Solution
A thermal management apparatus featuring a circuit assembly with first and second thermally conductive layers on each side of the substrate, thermally coupled to heat generating components, which transfers and spreads heat to the outside through conduction and convection, using deformable or shaped materials to enhance contact and reduce space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling with heat sinks and fans is used, then heat dissipation capability is improved, but device volume increases and air circulation space is consumed
Solution Approach 1:
The patent merges the heat dissipation function directly into the circuit substrate by integrating thermally conductive pathways and heat dissipation structures within the substrate itself, eliminating the need for separate heat sinks and fans, thereby reducing overall device volume while maintaining effective heat dissipation
Solution Approach 2:
The patent transitions from traditional three-dimensional air cooling structures to a planar two-dimensional heat dissipation approach by incorporating thermal management features directly in the substrate plane, allowing heat dissipation without increasing device height or occupying additional air circulation space
2Length of stationary object
If spacers are provided between stacked substrates to create air gaps, then air flow space is improved, but cooling effectiveness remains insufficient for double-sided substrates
Solution Approach 1:
The patent segments the heat dissipation function into multiple independent thermally conductive pathways distributed across the substrate, allowing heat to be conducted away through multiple parallel routes rather than relying solely on air gaps, thereby improving cooling effectiveness without requiring large spacer distances
Solution Approach 2:
The patent introduces thermally conductive materials and pathways as intermediaries between the heat-generating components and the substrate surface, facilitating more efficient heat transfer from the components through the substrate without requiring direct reliance on air gaps created by spacers
3Temperature
If heat conductive paths are provided from each substrate to a heat sink on top of the stack, then heat transfer is improved, but air flow between substrates is still restricted and device volume increases
Solution Approach 1:
The patent extracts the heat sink function from the traditional external placement on top of substrate stacks and integrates it directly into the substrate structure itself, eliminating the need for additional volume while maintaining effective heat transfer pathways
Solution Approach 2:
The patent transitions from vertical three-dimensional heat transfer to horizontal two-dimensional heat dissipation within the substrate plane, allowing heat to be distributed and dissipated across the substrate surface without requiring additional vertical space for heat sinks
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively cools heat generating components on single- or double-sided substrates in confined spaces by improving heat transfer efficiency and reducing the volume of cooling solutions, while maintaining operational temperatures and accommodating space constraints.
Implementation Method 1
a first thermally conductive layer disposed on each side of the circuit substrate and being thermally coupled to one or more heat generating components of the circuit substrate; a second thermally conductive layer disposed on each side of the circuit substrate and being thermally coupled to the first thermally conductive layer
Implementation Method 2
The first thermally conductive layer and the thermally conductive layer can be shaped, sized, and/or configured to provide cooling of the one or more heat generating components disposed on each side of the circuit substrate by transferring and spreading the heat to the outside of the circuit assembly
Data Source
AI summary
The present disclosure relates to thermal management apparatus for a circuit substrate having heat generating components mounted on one or both sides thereof. The apparatus and method includes a circuit assembly having a first thermally conductive layer disposed on each side of the circuit substrate and being thermally coupled to one or more heat generating components of the circuit substrate. The apparatus and method includes a second thermally conductive layer disposed on each side of the circuit substrate and being thermally coupled to the first thermally conductive layer. The first thermally conductive layer and the thermally conductive layer can be shaped, sized, and/or configured to provide cooling of the one or more heat generating components disposed on each side of the circuit substrate by transferring and spreading the heat to the outside of the circuit assembly.