Circuitized Substrate With Internal Cooling Structure
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Solution Overview
Problem
Current circuitized substrates face challenges in effectively dissipating heat generated by electronic components, particularly in high-power applications where existing heat dissipation methods like heat sinks and heat pipes may not adequately prevent thermal fatigue and malfunction.
Innovation Solution
A circuitized substrate with a thermal cooling structure integrated into its design, featuring dielectric and conductive layers stacked with thermally conductive thru-holes that allow cooling fluid to pass through, providing enhanced heat dissipation from electrical components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks with projecting elements are used to dissipate heat, then heat dissipation surface area is increased, but device complexity and space requirements increase
Solution Approach 1:
The patent merges the heat dissipation function directly into the substrate by forming thermally conductive vias that extend through the substrate layers to expose thermal conductive material on the opposite surface. This eliminates the need for separate heat sink structures while maintaining effective heat dissipation, thereby reducing device complexity and integrating cooling into the base structure.
Solution Approach 2:
Instead of adding heat dissipation surface area in the vertical dimension with projecting heat sink elements, the patent utilizes the substrate's internal volume by creating through-substrate thermal vias. This dimensional approach allows heat to be conducted through the substrate thickness to the opposite surface, providing cooling without increasing external profile or adding complex three-dimensional structures.
2Temperature
If insulated metal substrate technology is used for heat dissipation, then thermal conduction is improved, but heat dissipation may be insufficient for high-power applications
Solution Approach 1:
The patent segments the thermal conduction path into multiple layers by creating thermally conductive vias that extend through different substrate layers. This segmented approach allows heat to be conducted efficiently from the component mounting surface through intermediate layers to the opposite surface, providing enhanced thermal management capability that overcomes the limitations of single-layer insulated metal substrates in high-power applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively enhances heat removal from electronic components, preventing thermal fatigue and ensuring reliable operation in high-power applications by utilizing thermally conductive paths and fluid cooling within the substrate.
Implementation Method 1
thermally conductive thru-holes... providing enhanced heat dissipation from electrical components
Implementation Method 2
cooling fluid to pass through, providing enhanced heat dissipation from electrical components
Data Source
AI summary
An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation. The thermal cooling structure is adapted for having cooling fluid pass there-through during operation of the assembly. A method of making the substrate is also provided.