Circular Display Substrate Via Hole Backside Driver Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional display panels for smart watches require a narrow frame characteristic, making it challenging to configure a control chip within the circular display area without compromising the perfect circular shape, as existing technologies often place the drive circuit outside the circular area to accommodate the chip.
Innovation Solution
The array substrate features a base substrate with data lines, gate lines, and gate auxiliary lines, connected via holes on the front and back sides, allowing the driver circuit to be placed on the back side of the circular array substrate, maintaining a perfect circular display area while fulfilling the narrow frame requirement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the drive circuit is placed outside the circular display area to accommodate the control chip, then the control chip can be integrated, but the perfect circular shape and narrow frame characteristic are compromised
Solution Approach 1:
The patent moves the drive circuit from the traditional planar arrangement (outside the circular area) to a three-dimensional configuration by routing signal lines through holes from the front surface to the back surface of the substrate. This allows the control chip to be mounted on the back surface within the circular area, maintaining the perfect circular shape while achieving chip integration through vertical space utilization.
Solution Approach 2:
The patent embeds the drive circuit components within the circular display area by creating through-holes that penetrate the substrate. The signal lines are nested within these through-holes, and the control chip is nested on the back surface within the circular boundary, achieving a compact integrated structure that preserves the circular aesthetic.
2Adaptability or versatility
If the drive circuit is placed outside the circular display area, then the control chip can be integrated, but the frame width increases
Solution Approach 1:
The patent transitions from a two-dimensional planar layout to a three-dimensional structure by utilizing through-holes that extend vertically through the substrate. This allows the control chip to be positioned on the back surface within the circular area, eliminating the need to extend the frame width outward while still accommodating the chip.
3Adaptability or versatility
If signal lines are routed through holes from front to back surface, then the control chip can be integrated within the circular area, but the manufacturing process becomes more complex
Solution Approach 1:
The patent divides the substrate into distinct functional regions: the front surface for display elements, the back surface for the control chip, and through-holes for signal transmission. This segmentation allows each region to be optimized and manufactured separately using standardized processes, reducing overall manufacturing complexity despite the three-dimensional routing.
Solution Approach 2:
The through-holes serve multiple functions: they provide mechanical support, enable electrical signal transmission between front and back surfaces, and define the integration pathway for the control chip. This multi-functionality reduces the need for additional specialized structures, simplifying the manufacturing process.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
An array substrate, a method for fabricating the array substrate, and a related display device are provided. The array substrate comprises: a base substrate (110) with a plurality of first via holes (150); a plurality of first signal lines (120) on a first side of the base substrate (110); and a plurality of first signal driver lines (210) on a second side of the base substrate (110); wherein each first signal line (120) is connected with at least one first signal driver line (210) through at least one first via hole (150).