Circular Gas Passage Stabilizes Flow in Semiconductor Heating Base
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional gas providing passages in heating devices for semiconductor and liquid crystal substrate processing are prone to unstable gas flow and deformation, leading to inconsistent gas supply.
Innovation Solution
A processing device with a base featuring circular cross-section gas providing passages that stabilize gas flow by reducing heat conduction interference from the resistance heating body and preventing deformation through precise machining, ensuring uniform heating and stable gas delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional gas providing passage is formed by bonding ceramic plates with rectangular grooves, then the structure can be manufactured, but the gas flow becomes unstable and the passage deforms due to heat
Solution Approach 1:
The gas providing passage is changed from a rectangular cross-section to a circular cross-section. This curvature change eliminates the corners where heat accumulates and causes deformation, resulting in stable gas flow without the reliability issues of the conventional rectangular design
Solution Approach 2:
The invention changes the geometric parameter of the passage cross-section from rectangular to circular. This parameter change fundamentally alters the heat distribution and flow characteristics, eliminating the deformation problem while maintaining manufacturability through standard ceramic processing techniques
2Ease of manufacture
If ceramic plates are bonded to form the gas providing passage, then the passage can be constructed, but deformation occurs during heating causing unstable gas flow
Solution Approach 1:
The circular cross-section design eliminates the rectangular corners that are prone to heat concentration and deformation. The curved geometry distributes thermal stress uniformly, maintaining dimensional stability under heating conditions while preserving the bonded ceramic plate construction method
3Productivity
If the gas providing passage is heated during operation, then gas can be supplied, but the passage deforms leading to unstable flow and difficulty in stable gas provision
Solution Approach 1:
The circular cross-section passage design inherently resists thermal deformation by distributing heat uniformly around the circumference. This maintains consistent gas flow characteristics during heating operations, ensuring reliable and stable gas provision to the processing chamber
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves stable and uniform gas supply to the substrate, reducing gas flow loss and enhancing heating performance by maintaining a consistent flow rate and temperature distribution.
Implementation Method 1
reducing heat conduction interference from the resistance heating body
Implementation Method 2
a resistance heating body 12
Data Source
AI summary
A processing device is provided, including a base which holds a processing target. A gas providing passage having a circular cross section is formed in the base, and provides gas to an outer circumference of the base.


