Circular Heatsink with Integrated Emissive Surface for Thermal Management

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Solution Overview

Problem

Existing systems for cooling and heat dissipation in high-power electronics, such as those in turbine engines, require complex heat exchangers and forced liquid cooling, which are inefficient and space-consuming.

Innovation Solution

A circular heatsink with a thermally conductive cylinder and emissive and convective surface area, combined with thermally conductive ledges to support heat-generating components, utilizing air flow for thermal conduction away from components through the cylinder and surface area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If complex heat exchangers and forced liquid cooling are used to dissipate heat from high-power electronics, then heat dissipation effectiveness is improved, but device complexity and space requirements increase

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoidcooling system complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the cooling fan, heatsink, and electrical components into a single integrated assembly. The heatsink is formed as part of the fan housing structure, eliminating the need for separate heat exchangers and complex cooling systems. This merging of functions directly reduces device complexity while maintaining effective heat dissipation through the integrated emissive surface area.

Inventive Principle:

Principle #5Merging (Combining)

2Temperature

If complex heat exchangers and forced liquid cooling are used to dissipate heat from high-power electronics, then heat dissipation effectiveness is improved, but space requirements increase

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoidspace requirements

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The cooling fan, heatsink, and electrical components are merged into a single compact integrated assembly. The heatsink structure is formed within the fan housing, eliminating the need for separate heat exchanger components and reducing overall system volume. This integration directly addresses the space constraint problem while maintaining effective heat dissipation.

Inventive Principle:

Principle #5Merging (Combining)

3Ease of operation

If heat-generating electrical components are located near the turbine for controlling the cooling fan, then control functionality is improved, but heat concentration increases

Engineering Contradiction:

Improvecontrol functionalityVSAvoidheat concentration

Core Design Contradiction:

Ease of operationVSTemperature

Solution Approach 1:

The patent introduces a thermally conductive heatsink structure as an intermediary between the heat-generating electrical components and the cooling air flow. The heatsink absorbs and dissipates heat from the components through its emissive surface area, acting as a thermal mediator that enables close proximity placement of components without excessive heat concentration.

Inventive Principle:

Principle #24Intermediary (Mediator)

4Device complexity

If air flow from the cooling fan is used for thermal conduction through the thermally conductive cylinder, then heat dissipation simplicity is improved, but cooling effectiveness must be maintained

Engineering Contradiction:

Improvecooling system simplicityVSAvoidcooling effectiveness

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The cooling fan serves multiple functions: it provides air flow for cooling the turbine engine components and simultaneously drives thermal conduction through the thermally conductive cylinder to dissipate heat from the electrical components. This multi-functionality maintains cooling effectiveness while simplifying the overall system by eliminating separate cooling mechanisms.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces the operating temperature of heat-generating components, minimizing the need for complex heat exchangers and forced liquid cooling, while maintaining efficient thermal management.

Implementation Method 1

thermal conduction away from the heat-generating electrical components and through the at least one thermally conductive ledge, the thermally conductive cylinder, and the emissive and convective surface area

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

emissive and convective surface area

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

emissive and convective surface area

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS10794637B2Circular heatsink

Publication Date: 2020.10.06 GE AVIATION SYSTEMS LLC

AI summary

A circular heatsink can include a thermally conductive cylinder with an outer circumferential surface and an inner circumferential surface. An emissive and convective and convective surface area can extend radially from the outer circumferential surface. At least one thermally conductive ledge can extend from the inner circumferential surface and be configured to support a planar substrate having heat-generating electrical components. Air flow over the emissive and convective surface area can cause thermal conduction away from the heat-generating electrical components and through the at least one thermally conductive ledge, the thermally conductive cylinder, and the emissive and convective surface area.