Circular Interposer Alignment for PCB Stack Thickness
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Solution Overview
Problem
The increasing complexity and data transfer demands between stacked printed circuit boards in electronic devices require reliable, space-efficient, and high-speed interconnections, while existing solutions often result in thicker stacks and complex manufacturing processes.
Innovation Solution
A non-rectangular interposer with alignment features such as threaded bosses, collets, and alignment pins is used to create reliable and space-efficient interconnections between stacked printed circuit boards, utilizing spring-like contacts and various fastening methods to ensure mechanical stability and high-speed data transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional rectangular interposers and complex fastening methods are used, then mechanical stability is achieved, but device thickness increases and manufacturing complexity increases
Solution Approach 1:
The patent employs a circular interposer instead of a traditional rectangular shape. This circular geometry reduces the overall footprint and thickness of the stacked board assembly while maintaining structural integrity. The curved shape allows for more efficient space utilization and reduces the distance between contact points, thereby achieving mechanical stability with reduced device thickness.
Solution Approach 2:
The fastening system is divided into multiple discrete alignment features (protrusions and recesses) distributed around the circular interposer. This segmentation allows for precise positioning and stable mechanical connection without requiring a single complex fastening mechanism, thereby reducing overall thickness while maintaining reliability.
2Reliability
If more alignment features and fastening mechanisms are added, then connection reliability improves, but manufacturing complexity increases
Solution Approach 1:
The patent integrates multiple functions into the circular interposer structure itself. The alignment features (protrusions and recesses) are built directly into the interposer geometry, eliminating the need for separate fastening components. This merging of alignment and fastening functions into a single integrated structure improves connection reliability while simplifying manufacturing processes.
Solution Approach 2:
The circular interposer incorporates asymmetric alignment features with specific protrusions and recesses positioned at predetermined locations. This asymmetric design provides unique orientation and precise alignment during assembly, ensuring reliable connections without requiring complex symmetric fastening mechanisms, thereby reducing manufacturing complexity.
3Volume of moving object
If the interposer size is reduced for space efficiency, then device miniaturization is achieved, but alignment precision becomes more difficult
Solution Approach 1:
The circular interposer incorporates pre-formed alignment protrusions and recesses that are created during the interposer manufacturing process itself. These preliminary alignment features are precisely positioned in advance, ensuring accurate alignment during assembly even when the overall device size is reduced. This preliminary action eliminates the need for complex post-assembly alignment procedures.
Solution Approach 2:
The circular geometry of the interposer provides continuous curvature that facilitates precise rotational alignment. The curved edges and distributed alignment features around the circle allow for self-aligning characteristics during assembly, maintaining high alignment precision even in miniaturized configurations where traditional linear alignment methods would be insufficient.
Data Source
AI summary
Non-rectangular or rectangular interposers for space efficient, reliable to manufacture, high speed interconnections between two printed circuit boards, such as a motherboard and a mating board. One example provides space efficiency with a non-rectangular interposer, where the interposer may be at least approximately circular. Reliable manufacturing may be provided by the inclusion of one or more openings to accept one or more alignment features. In one example, a first opening is provided to accept a threaded boss, which may be used to fasten the two printed circuit boards and interposer together. In another example, a second opening may be provided to accept an alignment post, wherein the post aligns the interposer to the two printed circuit boards. Contacts may be provided on each side to mate with contacts on each of the two printed circuit boards.