Circular Orbit Substrate Transfer System for Parallel CMP
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Solution Overview
Problem
The semiconductor manufacturing process faces inefficiencies in the chemical mechanical polishing (CMP) process due to the need for frequent substrate transfers and the difficulty in flattening multilayer structures, which hinders the simultaneous processing of multiple substrates and increases production time.
Innovation Solution
A substrate transferring system that employs multiple transfer units operating on circular orbits perpendicular to the ground, allowing for simultaneous transfer and polishing of substrates, reducing the substrate transfer path and enabling continuous parallel processing by overlapping orbits and using transfer arms and carrier heads for efficient loading and unloading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional sequential substrate transfer and polishing processes are used, then process simplicity is maintained, but production efficiency is reduced due to frequent substrate transfers and inability to process multiple substrates simultaneously
Solution Approach 1:
The system divides the substrate processing into separate functional modules: first transfer unit for loading, second transfer unit for polishing, and return unit for unloading. Each unit operates independently on its own circular orbit, allowing parallel processing of multiple substrates while maintaining operational simplicity through modular design
Solution Approach 2:
The system combines multiple substrate transfer and polishing operations into a single integrated system where the first transfer unit, second transfer unit, and return unit work concurrently. Multiple substrates are processed simultaneously in parallel sequences, increasing production efficiency without requiring separate independent systems
2Loss of time
If substrate transfer path is reduced by using direct transfer, then transfer time is minimized, but transfer reliability may be compromised due to overlapping orbits and simultaneous operations
Solution Approach 1:
The transfer units move substrates along circular orbits rather than straight-line paths. The first transfer unit rotates on a first axis along a circular first orbit, and the second transfer unit rotates on a second axis along a circular second orbit. This curved path design allows for smoother, more reliable transfers while maintaining short transfer distances through the overlapping orbit configuration
Solution Approach 2:
The overlapping orbit design creates an intermediary transfer zone at the first point where substrates can be reliably transferred between units. This intermediary zone acts as a buffer that ensures reliable transfer even during simultaneous operations, preventing direct conflict between transfer paths
3Productivity
If multiple substrates are processed in parallel, then production efficiency is improved, but process coordination complexity increases due to simultaneous transfer and polishing operations
Solution Approach 1:
The system employs periodic rotational motion where the first transfer unit rotates on a first axis and the second transfer unit rotates on a second axis in coordinated periodic cycles. Substrates are transferred at specific periodic intervals at the first point, and polishing occurs at specific intervals at the third point, creating a rhythmic parallel processing pattern that simplifies coordination
Solution Approach 2:
The system maintains continuous operation through overlapping circular orbits that enable uninterrupted substrate flow. While one substrate is being polished at the third point, another substrate can be transferred at the first point, and a third substrate can be loaded or unloaded at the second point. This continuous parallel action maximizes productivity without requiring complex start-stop coordination
Data Source
AI summary
A substrate transferring system may include a first transfer unit to transfer a substrate along a circular first orbit while rotating on a first axis perpendicular to a ground, and a second transfer unit to transfer a substrate along a circular second orbit while rotating on a second axis perpendicular to the ground, wherein the first orbit and the second orbit may overlap with each other at a first point, and at the first point, a substrate may be transferred from the first transfer unit to the second transfer unit or from the second transfer unit to the first transfer unit.