Circular Rail Thermal Channel for SSD Heat Dissipation

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Solution Overview

Problem

The integration of solid-state drives with computing systems poses challenges due to heat generation and power consumption, leading to reduced performance and reliability, with existing solutions failing to effectively address these issues.

Innovation Solution

A thermal channel is formed by attaching a top board and a bottom board to a circular rail with airflow tabs, creating a pathway for air to flow through a vent opening, enhancing heat dissipation and reducing operational temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If solid-state drives are integrated with computing systems, then data storage functionality is improved, but heat generation increases causing reduced reliability

Engineering Contradiction:

Improvedata storage functionalityVSAvoidsystem reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

A thermal channel structure is introduced as an intermediary between the solid-state drive and the environment. This channel includes a top board, bottom board, and side walls that collectively form a dedicated pathway for heat and air flow, separating the thermal management function from the drive housing and improving reliability through specialized heat dissipation

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal management system is segmented into distinct components: a top board, a bottom board, and side walls that form separate but connected thermal channels. This segmentation allows optimized heat flow paths for different components while maintaining structural integrity and electrical connectivity

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If solid-state drives are integrated with computing systems, then data storage functionality is improved, but power consumption increases leading to heat generation

Engineering Contradiction:

Improvedata storage functionalityVSAvoidpower consumption

Core Design Contradiction:

Adaptability or versatilityVSUse of energy by moving object

Solution Approach 1:

The thermal channel acts as an intermediary structure that facilitates efficient heat removal from power-consuming components. The dedicated airflow pathway reduces thermal resistance and enables more effective heat transfer from the solid-state drive to the surrounding environment, mitigating the thermal effects of increased power consumption

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If thermal channel is formed by attaching boards to circular rail, then heat dissipation efficiency is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidassembly complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The circular rail serves multiple functions simultaneously: it provides structural support for mounting boards, acts as an electrical connection pathway through conductive material, forms part of the thermal channel structure, and enables airflow direction. This multi-functionality reduces the need for separate components and simplifies the overall assembly process

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Temperature

If airflow path is structured through vent opening, then cooling efficiency is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvecooling efficiencyVSAvoidassembly precision

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

Multiple functions are merged into the circular rail component: structural support, electrical connectivity, thermal channel formation, and airflow guidance. By combining these functions into a single integrated component with standardized features, the patent reduces the number of separate parts that require precise alignment and assembly, thereby lowering manufacturing precision requirements

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration increases the reliability and cooling efficiency of electronic assemblies by providing a structured airflow path for heat dissipation, reducing temperatures and preventing thermal damage, while also offering electrostatic discharge protection.

Implementation Method 1

a thermal channel between the top board and the bottom board for directing air through a vent opening of the circular rail

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 2

the airflow bracket electrically coupling the circular rail and the airflow tab

Methodology Applied

Scientific EffectElectrostatic discharge: Electrostatic Discharge

Data Source

PatentUS9898056B2Electronic assembly with thermal channel and method of manufacture thereof

Publication Date: 2018.02.20 SANDISK TECHNOLOGIES LLC

AI summary

An electronic assembly and method of manufacturing includes: an airflow bracket having a circular rail and an airflow tab, the airflow bracket electrically coupling the circular rail and the airflow tab; a top board attached to the circular rail for electrically coupling the top board and the circular rail; and a bottom board attached to the circular rail for electrically coupling the top board and the circular rail, the bottom board positioned to form a thermal channel between the top board and the bottom board for directing air through a vent opening of the circular rail.