Circular Silicon Wafer X-ray Detector Eliminates Tile Assembly
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Solution Overview
Problem
Conventional solid-body X-ray image detectors require multiple tiles and significant assembly effort to achieve a circular detector surface, leading to inefficiencies in silicon wafer usage, increased costs, and reduced mechanical stability due to joints and potential breakage.
Innovation Solution
A solid-body X-ray image detector utilizing a single, uncut crystalline silicon wafer with a two-dimensional CCD or CMOS sensor and a scintillator, where the detector pixels cover a circular surface area except for a narrow edge region, eliminating the need for tile assembly and enhancing mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If multiple detector tiles are assembled to achieve a circular detector surface, then the circular detector surface area is obtained, but the mechanical stability decreases due to joints and potential breakage
Solution Approach 1:
The patent merges multiple detector tiles into a single integrated detector unit with a circular active area. The detector pixels are arranged on a substrate to form a continuous circular detection surface without joints between separate tiles, eliminating the mechanical weaknesses associated with tiled assemblies while maintaining the desired circular shape.
2Shape
If multiple detector tiles are used to form a circular detector, then the circular surface is achieved, but assembly complexity and costs increase
Solution Approach 1:
The invention combines multiple detector elements into a single monolithic structure where detector pixels are fabricated directly on a substrate in a circular arrangement. This eliminates the need for separate tile assembly operations, reducing manufacturing complexity and costs while achieving the circular detector surface.
3Shape
If multiple detector tiles are assembled to create a circular detector, then the circular surface area is obtained, but silicon wafer usage efficiency decreases
Solution Approach 1:
The patent employs a circular arrangement of detector pixels on the substrate, utilizing the curved geometry to maximize the effective use of the silicon wafer area. This circular configuration allows for more efficient packing and utilization of the wafer material compared to rectangular tile assemblies, reducing waste and improving silicon usage efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces silicon wafer usage by over 50%, eliminates assembly costs, and increases mechanical stability while maintaining a circular detector surface area, making the detector more robust and economically viable.
Implementation Method 1
a scintillator (not shown) on the first side of the silicon wafer, opposite the photodiode array
Implementation Method 2
a photodiode array, integrated in a two-dimensional CCD or CMOS sensor, on the other side of the silicon wafer
Data Source
AI summary
A solid-body X-ray image detector and method of manufacturing the same are disclosed. The detector has a circular surface area arrangement of CCD or CMOS detector pixels on a substrate, a scintillator arranged on the substrate, and a circular detector surface area, wherein the substrate comprises a single, substantially circular silicon wafer and the detector surface area takes up the surface area of the silicon wafer up to a narrow edge region.