Circular Support Substrate with Asymmetric Chords for Wafer Positioning

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Solution Overview

Problem

Existing semiconductor package manufacturing processes require larger equipment due to the need for larger circular support substrates with marking-off lines or additional optical detection systems for precise positioning, which increases complexity and size requirements.

Innovation Solution

A circular support substrate with non-linearly symmetrical chords along its circumference, allowing positioning based on its outer periphery shape, and made from materials like 42 alloy or Kovar alloy to match thermal expansion coefficients of semiconductor chips, enabling precise positioning without the need for additional markings or optical systems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If marking-off lines or additional marks are provided on the support substrate for positioning, then positioning accuracy is improved, but the support substrate must be made larger than the wafer

Engineering Contradiction:

Improvepositioning accuracyVSAvoidsupport substrate size

Core Design Contradiction:

Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent applies asymmetry by providing marking-off lines only on specific arcs of the support substrate periphery rather than symmetrically around the entire circumference. Specifically, marks are placed on arcs that do not exceed 180 degrees, creating an asymmetric pattern that enables positioning while allowing the substrate to be sized equal to or smaller than the wafer. This asymmetric mark arrangement provides sufficient positioning information without requiring the substrate to be larger than the wafer.

Inventive Principle:

Principle #4Asymmetry

2Measurement precision

If an optical detection film is added to the support substrate for positioning, then positioning accuracy is improved, but the device complexity and manufacturing steps increase

Engineering Contradiction:

Improvepositioning accuracyVSAvoidoptical system complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the optical detection film and associated optical measurement systems from the positioning process. Instead, it uses simple visual marking-off lines on the support substrate periphery that can be detected without complex optical equipment. This extraction principle removes the harmful complexity of optical systems while maintaining positioning capability through geometric mark patterns.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the optical detection system with a mechanical/geometric marking system. Rather than using optical films and sensors to detect position, the invention uses physically visible marking-off lines on the substrate edge that provide positioning information through their geometric arrangement. This substitution eliminates the need for complex optical measurement apparatus.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of operation

If the support substrate is made larger than the wafer to accommodate positioning marks, then positioning is easier, but the manufacturing equipment size must be increased

Engineering Contradiction:

Improvepositioning easeVSAvoidequipment size

Core Design Contradiction:

Ease of operationVSLength of stationary object

Solution Approach 1:

The asymmetric arrangement of marking-off lines on specific arcs enables easy positioning without requiring the substrate to be larger than the wafer. The non-uniform distribution of marks provides clear positioning references that are easy to detect visually or with simple sensors, while keeping the overall substrate size compact and compatible with standard wafer-sized equipment.

Inventive Principle:

Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables precise positioning and reduces the size requirements of manufacturing equipment by allowing the support substrate to be only slightly larger than the wafer, while preventing separation issues at the interface and allowing for differentiation between faces based on chord positional relationships.

Implementation Method 1

a circular support substrate having at least three chords along its circumference, wherein the chords are provided at positions where they do not run linearly symmetrical to a straight line passing through the center axis of the circular support substrate

Methodology Applied

Scientific EffectGeometric positioning: Geometry

Implementation Method 2

made from materials like 42 alloy or Kovar alloy to match thermal expansion coefficients of semiconductor chips, enabling precise positioning without the need for additional markings or optical systems

Methodology Applied

Scientific EffectThermal expansion matching: Thermal Expansion

Data Source

PatentUS10163674B2Circular support substrate for semiconductor

Publication Date: 2018.12.25 NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE & TECHNOLOGY

AI summary

An object of the present invention is to provide a circular support substrate that allows for positioning based solely on its outer periphery shape. As a means for solving the problems, a circular support substrate is provided that has at least three chords along its circumference, wherein the chords are provided at positions where they do not run linearly symmetrical to the straight line passing through the center axis of the circular support substrate.