Circular Target Cooling Grooves for Stable Sputter Deposition

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Solution Overview

Problem

The physical vapor deposition process in semiconductor manufacturing often leads to overheating and deformation of targets and components due to argon ion bombardment, resulting in chamber downtime and non-uniform deposition.

Innovation Solution

A smart cooling system with cooling grooves in various patterns on the target surface and a coolant circulation system that maintains the target and components within a predetermined temperature range, using deionized water, glycol, or propylene as coolants, to efficiently transfer heat and prevent thermal deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If sputtering process is used to deposit materials on substrate, then deposition performance is improved, but target overheating and deformation occurs

Engineering Contradiction:

Improvedeposition performanceVSAvoidtarget temperature

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The target surface is segmented into multiple cooling zones with grooves of varying depths and patterns. Different regions receive different cooling intensities based on their specific thermal loads, allowing efficient heat dissipation while maintaining deposition performance.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Cooling grooves are designed with non-uniform depth and distribution patterns across the target surface. Areas with higher heat generation receive deeper or more密集 cooling grooves, while cooler areas have shallower grooves, optimizing heat removal where needed most without compromising overall deposition quality.

Inventive Principle:

Principle #3Local quality

2Productivity

If continuous sputtering is performed to increase productivity, then chamber running time increases, but target deformation and downtime increase

Engineering Contradiction:

Improvechamber running timeVSAvoidtarget deformation

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

Cooling grooves are pre-formed on the target surface before sputtering begins. The coolant circulation system is pre-configured to flow through these grooves, establishing heat dissipation pathways in advance to prevent thermal accumulation and deformation during continuous operation.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The coolant circulation system operates continuously throughout the sputtering process, maintaining constant heat removal from the target surface. This continuous cooling action enables uninterrupted deposition operations, maximizing chamber running time without causing target deformation.

Inventive Principle:

Principle #20Continuity of useful action

3Temperature

If cooling grooves are added to target to prevent overheating, then temperature control is improved, but device complexity increases

Engineering Contradiction:

Improvetemperature controlVSAvoidtarget structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The cooling system utilizes hydraulic principles by circulating liquid coolant through grooves machined into the target surface. This approach provides efficient heat transfer using well-understood fluid dynamics, achieving temperature control without requiring complex active cooling mechanisms.

Inventive Principle:

Principle #29Pneumatics and hydraulics

Solution Approach 2:

The cooling grooves are integrated directly into the target structure itself, allowing the target to cool itself during operation. The coolant flows through the grooves and absorbs heat directly at the heat generation site, eliminating the need for separate external cooling apparatus.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces the likelihood of target deformation, extends its lifetime, and ensures uniform deposition by maintaining temperature stability, thereby increasing chamber running time and deposition performance.

Implementation Method 1

A smart cooling system with cooling grooves in various patterns on the target surface and a coolant circulation system that maintains the target and components within a predetermined temperature range... to efficiently transfer heat and prevent thermal deformation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

When the positively charged argon ions strike the target surface, the momentum of the positively charged argon ions transfers to the target material to dislodge one or more atoms of the target material which eventually deposit on the substrate

Methodology Applied

Scientific EffectMomentum transfer: Conservation of Momentum

Implementation Method 3

When the argon gas is introduced into the chamber, a plurality of collisions occurs with electrons released from the cathode. This causes the argon gas to lose its outer electrons and become positively charged argon ions

Methodology Applied

Scientific EffectIonization: Ionisation

Data Source

PatentUS12198927B2Deposition system and method

Publication Date: 2025.01.14 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A deposition system is provided capable of extending the chamber running time by preventing the target and other components from deformation due to thermal stress from the sputtering process by maintaining the temperature within the predetermined temperature range. The deposition system includes a substrate process chamber, a target within the substrate process chamber, and a plurality of grooves formed on the target in a circular formation. The plurality of grooves includes a first groove on a center portion of the target and a second groove on a periphery portion of the target.