Circular Semiconductor Wafer Alignment Without Notch Cutouts

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Solution Overview

Problem

The number of devices that can be formed on a semiconductor wafer with a notch or orientation flat is limited, necessitating an improvement in the alignment and patterning process.

Innovation Solution

A semiconductor wafer with a circular shape and no cutout portions is used, along with a method that includes applying a photosensitizer, detecting crystal orientation, and aligning the wafer in a predetermined orientation for precise patterning without relying on notches or orientation flats.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a notch or orientation flat is formed on the wafer to indicate crystal orientation, then the alignment and patterning process can be performed, but the number of devices that can be formed on the wafer surface is limited

Engineering Contradiction:

Improvealignment precisionVSAvoidnumber of devices per wafer

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The invention extracts and removes the notch or orientation flat from the wafer structure. By eliminating these cutout portions that previously occupied valuable wafer perimeter area, the entire circular wafer surface becomes available for device formation, thereby increasing the number of devices per wafer while maintaining alignment precision through alternative crystal orientation detection methods

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention makes the wafer perimeter universally available for device formation rather than dedicating it to alignment features. The crystal orientation information is obtained through non-invasive measurement methods that do not require physical cutouts, allowing the entire wafer perimeter to participate in device manufacturing and maximizing productivity

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Measurement precision

If conventional methods using notches are used for alignment, then the crystal orientation can be detected, but the wafer area is reduced and manufacturing efficiency is limited

Engineering Contradiction:

Improvecrystal orientation detectionVSAvoidusable wafer area

Core Design Contradiction:

Measurement precisionVSArea of stationary object

Solution Approach 1:

The invention replaces the mechanical/notch-based crystal orientation indication system with an optical or measurement-based detection system. By using measurement methods that detect crystal orientation without physical cutouts, the usable wafer area is maximized while maintaining accurate crystal orientation detection capability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

Instead of using physical notches to represent crystal orientation information, the invention uses measurement data that copies or represents the crystal orientation state. The orientation information is captured through detection and stored as data, allowing the entire physical wafer surface to remain intact for device formation

Inventive Principle:

Principle #26Copying

Data Source

PatentUS20250364296A1Semiconductor wafer, method for processing semiconductor wafer, and processing apparatus

Publication Date: 2025.11.27 DISCO CORP

AI summary

A semiconductor wafer has a first surface and a second surface which is a back surface opposite to the first surface. The semiconductor wafer has a circular shape having no cutout portion in a horizontal cross section.