Circumferential Exhaust Layout for Uniform Substrate Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional substrate processing apparatuses face challenges in achieving uniform gas distribution and exhaust, leading to non-uniform substrate processing results.
Innovation Solution
The apparatus includes a gas exhaust section with exhaust ports and passages configured along the circumferential direction of the processing chamber, ensuring uniform gas exhaust and improved in-plane uniformity by using symmetrical exhaust passages and buffer spaces to stabilize gas flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a baffle plate is installed around the mounting table to adjust gas flow direction, then gas flow direction can be controlled, but the structure becomes more complex and in-plane uniformity is not sufficiently improved
Solution Approach 1:
The exhaust system is segmented into multiple exhaust ports arranged circumferentially around the processing chamber, with each port connected to the internal space. This segmentation allows uniform exhaust gas removal from different regions, improving in-plane uniformity without requiring complex baffle plates for flow control
Solution Approach 2:
A buffer space is introduced as an intermediary between the exhaust ports and the exhaust passages. This buffer space stabilizes gas flow by providing a transition zone that prevents turbulence, thereby improving processing uniformity without adding complex flow control structures
2Manufacturing precision
If multiple manifolds are used to transfer processing gas, then gas distribution can be improved, but the device complexity increases
Solution Approach 1:
The exhaust ports are merged into a single circumferential arrangement that collectively serves the entire processing chamber. This unified exhaust structure achieves uniform gas distribution and exhaust without requiring multiple separate manifolds, thereby simplifying the device while maintaining processing uniformity
Data Source
AI summary
A substrate processing apparatus includes a processing chamber configured to accommodate a substrate in an internal space; a susceptor configured to mount the substrate in the internal space; a gas supply configured to supply a processing gas to the internal space; and a gas exhaust section configured to exhaust an exhaust gas containing the processing gas from the internal space. The gas exhaust section includes one or more exhaust ports communicating with the internal space of the processing chamber and extending along a circumferential direction of an inner circumferential surface of the processing chamber, the exhaust gas flowing into the one or more exhaust ports, and a plurality of exhaust passages communicating with the one or more exhaust ports and extending inside a wall of the processing chamber.