Circumrotatable Nozzle for Substrate Edge Fluid Alignment

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Solution Overview

Problem

In single substrate processing apparatuses, when a single nozzle arm holds multiple discharge ports, the discharge ports are often misaligned with the substrate's edge, leading to inadequate processing of the peripheral edge region due to varying distances from the rotational axis, causing processing fluid to deviate from the intended application area.

Innovation Solution

A substrate processing apparatus with a circumrotatable nozzle having multiple discharge ports, where the nozzle can be moved between central and peripheral edge processing positions, and its rotation direction is controlled to ensure accurate fluid application to the substrate's edge regardless of the discharge port used, using a nozzle moving unit and circumrotating unit to adjust the nozzle's position and orientation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a single nozzle arm holds multiple discharge ports, then the number of nozzle arms is reduced and productivity is improved, but the discharge ports are misaligned with the substrate's edge causing manufacturing precision to deteriorate

Engineering Contradiction:
ImprovethroughputVSAvoiddischarge port alignment precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The nozzle is made capable of circumrotation around the substrate's rotational axis, transforming from a static to a dynamic configuration. This allows the nozzle to adjust its orientation dynamically to align different discharge ports with the substrate's peripheral edge region, solving the alignment precision problem while maintaining the single nozzle arm structure for high productivity

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The nozzle is designed with multiple discharge ports positioned at different locations, and through circumrotation, each discharge port can be selectively positioned to face the substrate's peripheral edge. This segmentation of discharge functions across multiple ports, combined with rotational positioning, enables precise fluid delivery to the target region

Inventive Principle:
Principle #1Segmentation

2Reliability

If the peripheral edge portion processing position is set for one discharge port, then that discharge port can supply processing liquid to the peripheral edge region, but other discharge ports may have their supplying position deviated causing reliability to deteriorate

Engineering Contradiction:
Improveprocessing fluid supply reliabilityVSAvoiddischarge port positioning adaptability
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The circumrotatable nozzle allows dynamic repositioning of discharge ports to maintain reliable fluid supply to the peripheral edge region regardless of which discharge port is active. The system adapts its configuration based on operational requirements, ensuring consistent reliability across different discharge ports

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The single nozzle structure with multiple discharge ports serves multiple functions - each discharge port can be positioned to supply processing liquid to the peripheral edge region. This multi-functional design ensures that any discharge port can reliably perform the processing function when properly positioned through circumrotation

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS10665479B2Substrate treatment device and substrate treatment method
Publication Date: 2020.05.26 SCREEN HOLDINGS CO LTD
  • US10665479B2 patent drawing
  • US10665479B2 patent drawing
  • US10665479B2 patent drawing

AI summary

A substrate processing apparatus includes a rotating unit rotating a substrate around a predetermined first rotational axis passing through a central portion of a major surface of the substrate, a nozzle provided to be circumrotatable around a predetermined second rotational axis, discharging a processing fluid toward the major surface of the substrate, and having a plurality of discharge ports disposed at positions separated from the second rotational axis, a processing fluid supplying unit supplying the processing fluid to the plurality of discharge ports, and a nozzle moving unit moving the nozzle between a central portion processing position and a peripheral edge portion.