Clad Metal Frame Structure for Heat Dissipation in Slim Electronics
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Solution Overview
Problem
The slimming of electronic devices poses challenges in effectively dissipating heat emitted from components using heat radiation members like vapor chambers or heat pipes.
Innovation Solution
The electronic device incorporates a frame with a clad metal structure comprising a first metal with higher thermal conductivity and a second metal with greater strength, where the first metal is in direct or indirect contact with electronic components through openings, and heat conductors with higher thermal conductivity are used to transfer heat, while the frame is connected to the device's side through protrusions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of electronic devices is reduced for slimming design, then the device becomes more compact and portable, but the ability to dissipate heat from components is limited
Solution Approach 1:
The frame employs a composite structure consisting of a first metal material with high thermal conductivity (such as aluminum or copper) and a second metal material with high strength (such as stainless steel or titanium alloy). This composite construction enables the frame to simultaneously achieve effective heat dissipation through the high-conductivity metal and maintain structural integrity through the high-strength metal, resolving the contradiction between device slimming and heat dissipation capability
Solution Approach 2:
The frame incorporates local heat dissipation structures including heat dissipation holes, protrusions, and recesses that are strategically positioned to enhance heat transfer. The first metal material is specifically placed in regions requiring superior thermal conduction, while the second metal material is positioned where structural strength is critical, creating localized optimization of thermal and mechanical properties throughout the frame structure
2Temperature
If a clad metal structure with high thermal conductivity metal is used, then heat dissipation is improved, but the structural strength may be compromised
Solution Approach 1:
The frame uses a composite of two metal materials where the first metal material (aluminum, copper, or magnesium alloy) provides high thermal conductivity for effective heat dissipation, while the second metal material (stainless steel, titanium alloy, or nickel alloy) provides high structural strength. This composite material approach allows both thermal and mechanical requirements to be satisfied simultaneously without compromising either property
Solution Approach 2:
The frame is divided into multiple regions with different metal materials, where the first metal material is used in heat-generating areas requiring superior thermal conduction, and the second metal material is used in load-bearing areas requiring high strength. This segmentation allows each material to be optimally positioned according to its functional requirements, resolving the contradiction between thermal conductivity and structural strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for efficient heat diffusion and dissipation from electronic components, ensuring smooth heat management in slim devices.
Implementation Method 1
Heat emitted from the at least one electronic component is transferred to the clad metal. The first metal has a higher thermal conductivity than the second metal.
Implementation Method 2
heat radiation member such as a vapor chamber or a heat pipe to smoothly diffuse or dissipate heat emitted from at least one component
Implementation Method 3
heat radiation member such as a vapor chamber or a heat pipe to smoothly diffuse or dissipate heat emitted from at least one component
Data Source
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AI summary
According to an exemplary embodiment of the disclosure, an electronic device may include a front plate providing at least a portion of the front surface of the electronic device, a rear plate providing at least a portion of the rear surface of the electronic device, a side providing at least a portion of the side of the electronic device, a support portion located between the front plate and the rear plate and connected to the side, and at least one component located between the front plate and the rear plate, wherein the support portion includes a clad metal, and wherein heat emitted from the at least one electronic component is transferred to the clad metal.