Clad Textured Metal Substrate for Epitaxial Film Growth
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Solution Overview
Problem
Conventional textured metal substrates for forming epitaxial thin films suffer from poor strength and inadequate orientational structure, which affects the quality and moldability of the films, particularly in superconducting applications.
Innovation Solution
A clad textured metal substrate with a two-layer structure, comprising a silver layer with a {100} cube texture and a metallic layer, where the silver layer has a deviating angle of crystal axes ≤9 degrees, and a surface-activated bonding or diffusion-bonding process is used to ensure strong bonding and orientation without deforming the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a textured metal substrate is formed by recrystallization to achieve good orientation for epitaxial thin film growth, then the orientational structure is improved, but the strength of the substrate decreases
Solution Approach 1:
The invention employs a composite substrate structure consisting of a silver-based layer with recrystallized texture for good orientation and a supporting metallic layer for strength. The silver layer provides the necessary crystallographic orientation ({100} cube texture with deviating angle ≤9 degrees) for high-quality epitaxial growth, while the supporting layer compensates for the strength loss inherent in recrystallized metals, solving the contradiction between orientation quality and mechanical strength.
2Manufacturing precision
If the deviating angle of crystal axes is reduced to improve epitaxial film quality, then the orientational precision is improved, but the manufacturing complexity increases
Solution Approach 1:
The invention specifies a quantitative parameter range for the deviating angle of crystal axes (≤9 degrees) as a key control parameter. By establishing this clear numerical criterion, the patent transforms the abstract requirement of 'good orientation' into a measurable and controllable manufacturing parameter, enabling systematic process optimization through parameter adjustment rather than complex iterative manufacturing.
Solution Approach 2:
The substrate undergoes preliminary recrystallization treatment and texture control before the epitaxial thin film deposition process. By pre-establishing the {100} cube texture with controlled deviating angle in the silver layer, the substrate is prepared in advance to ensure high-quality epitaxial growth, eliminating the need for complex in-situ orientation adjustments during film deposition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a substrate with enhanced strength and orientation, enabling the growth of high-quality epitaxial thin films without damaging the substrate, and allows for various shapes and thicknesses, improving the workability of superconducting films.
Implementation Method 1
a substrate having excellent orientation can be easily obtained by appropriately adding working and heat treatment (recrystallization) to a silver-based metallic material
Implementation Method 2
a thin film produced while paying attention to characteristics of an epitaxial crystal structure
Data Source
AI summary
The present invention provides an oriented substrate for forming an epitaxial thin film thereon, which has a more excellent orientation than that of a conventional one and a high strength, and a method for manufacturing the same. The present invention provides a clad textured metal substrate for forming the epitaxial thin film thereon, which includes a metallic layer and a silver layer bonded to at least one face of the metallic layer, wherein the silver layer has a {100}<001> cube texture in which a deviating angle Δφ of crystal axes satisfies Δφ≦9 degree. The textured metal substrate can be manufactured by subjecting the silver sheet containing 30 to 200 ppm oxygen by concentration to the orienting treatment of hot-working and heat-treating, and bonding the metal sheet with the oriented silver sheet by using a surface activated bonding process.