Cladded Base Plate Pin-Fin Cooling for Power Modules
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Solution Overview
Problem
Current power electronic modules face challenges in managing increasing heat dissipation and power losses due to higher internal and external temperatures, especially in harsh environments, necessitating more effective cooling solutions.
Innovation Solution
A semiconductor device with a base plate featuring a bimetal or trimetal clad structure, where the second metal layer is deformed to form a pin-fin or fin cooling structure, integrated with a cooling chamber for efficient heat dissipation, and substrate assemblies with semiconductor chips bonded using suitable soldering techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If higher power applications are used to meet increasing power demands, then power output is improved, but heat dissipation and temperature increase
Solution Approach 1:
The base plate is segmented into multiple metal layers (first metal layer, second metal layer, third metal layer) with distinct functions. The second metal layer is deformed to create pin-fin cooling structures that segment the heat dissipation surface, increasing surface area for heat transfer while maintaining structural integrity for high power applications
Solution Approach 2:
The base plate uses a composite multi-layer metal structure where each layer has different properties optimized for specific functions: the first metal layer provides mechanical strength and solderability, the second metal layer provides thermal conductivity and cooling structure formation, and the third metal layer provides additional thermal management. This composite structure enables simultaneous high power output and effective heat dissipation
2Ease of manufacture
If conventional single-layer base plates are used, then manufacturing is simple, but cooling efficiency is insufficient for high temperature operation
Solution Approach 1:
The cooling structures (pin-fins or fins) are pre-formed by deforming the second metal layer during base plate fabrication, before the semiconductor chips are mounted. This preliminary formation of cooling structures ensures that the thermal management capability is built-in from the start, enabling reliable high-temperature operation without requiring additional complex cooling components to be added later
Solution Approach 2:
The multi-layer metal composite structure combines materials with different thermal and mechanical properties in a single integrated base plate. This composite design provides both the manufacturing simplicity of a unified base plate structure and the advanced cooling efficiency needed for high-temperature operation, eliminating the need for separate cooling components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a high-temperature, high-power electronic module capable of operating up to 200°C with enhanced cooling efficiency, reducing power losses and preventing overheating through effective heat transfer with liquid cooling.
Implementation Method 1
The second metal layer is deformed to provide a pin-fin or fin cooling structure
Implementation Method 2
The planar metal base plate may in turn be attached to a cooling element through which a coolant may flow to prevent overheating of the power electronic module during operation
Implementation Method 3
liquid cooling of the power electronics via cooling elements to prevent overheating
Data Source
AI summary
A semiconductor device includes a semiconductor chip coupled to a substrate and a base plate coupled to the substrate. The base plate includes a first metal layer clad to a second metal layer. The second metal layer is deformed to provide a pin-fin or fin cooling structure.