Clamp-Connected Electrostatic Transducer Without Solder or VOC Adhesives
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Solution Overview
Problem
Existing transducer manufacturing methods face challenges in achieving cost reduction, secure electrical connection between the electrode sheet and leading wire without using volatile adhesives or organic solvents, and ensuring flexibility and stretchability for attachment to complex surfaces, while also reducing thickness and avoiding the limitations of soldering or welding.
Innovation Solution
A transducer design featuring a sheet body with a dielectric layer and an electrode sheet, where the leading wire is fixed using a clamp that penetrates the sheet body and forms a fusion layer without volatile adhesives or organic solvents, allowing for direct electrical connection and reduced thickness at the connection site.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering or welding is used to connect the leading wire to the electrode sheet, then electrical connection is achieved, but the heating temperature must be below the melting temperature of the resin substrate, limiting the choice of joining methods
Solution Approach 1:
The patent replaces the thermal joining process (soldering/welding) with a mechanical joining process using a clamp. The clamp physically secures the leading wire to the electrode sheet through clamping force, eliminating the need for high-temperature heating that would risk melting the resin substrate. This mechanical substitution allows reliable electrical connection without temperature constraints.
2Object-affected harmful factors
If lead-free solder is used to meet environmental requirements, then environmental compliance is achieved, but the melting temperature is high, making it difficult to connect without damaging the electrode sheet
Solution Approach 1:
The patent replaces the thermal soldering process with a mechanical clamping system. The clamp applies mechanical pressure to secure the leading wire to the electrode sheet, eliminating the need for high-temperature lead-free solder that would still risk damaging the resin substrate. This approach maintains environmental compliance while avoiding temperature-related issues.
3Strength
If organic solvents are used to treat the dielectric surface for electrode lamination, then adhesion is improved, but volatile organic compound emissions occur, requiring suppression of VOC emission
Solution Approach 1:
The patent removes the organic solvent treatment step from the manufacturing process. Instead of using acetone or other organic solvents to treat the dielectric surface for improved adhesion, the invention employs a clamp-based mechanical joining method that secures the electrode to the dielectric layer without requiring chemical surface treatment. This extraction of the harmful chemical process eliminates VOC emissions while maintaining connection reliability.
4Reliability
If the leading wire is connected to the external electrode instead of the electrode sheet, then electrical connection is achieved, but cost reduction cannot be realized
Solution Approach 1:
The patent segments the connection function into two parts: the clamp provides mechanical securing and electrical connection to the electrode sheet, while the external electrode serves only as a terminal extension. This segmentation allows the leading wire to connect directly to the functional electrode sheet at the actuation site, eliminating unnecessary material and simplifying the manufacturing process, thereby reducing costs while maintaining reliable electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables cost-effective, reliable electrical connection, flexibility, and reduced thickness, while suppressing VOC emission and ensuring attachment to complex surfaces without compromising electrostatic capacitance.
Implementation Method 1
a first clamp which fixes the first leading wire to the sheet body portion
Implementation Method 2
a first main fusion layer which is formed of a fusion material, is disposed as at least a part of the dielectric layer on the first surface side within the dielectric layer or joined as a separate member to the first surface of the dielectric layer, and joins the dielectric layer and the first electrode sheet by fusion of the fusion material
Implementation Method 3
a transducer using an electrostatic capacitance between electrodes has been noticed
Data Source
Figure 1~3
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Figure 7~9
AI summary
Provided is a transducer which can be manufactured without using a volatile adhesive or an organic solvent and in which electrical connections between electrode sheets and leading wires can be secured via an approach other than soldering or welding. In a sheet body portion (10), a dielectric layer (11) and a first electrode sheet (12) are joined by a first main fusion layer (13) formed of a fusion material. A first conductive portion (21b) of a first leading wire (21) is fixed to the sheet body portion (10) by a first clamp (23). The first clamp (23) includes a plurality of first leg portions (23a) that penetrates the sheet body portion (10) in a thickness direction, a first coupling portion (23b) that couples the proximal ends of the plurality of first leg portions (23a) and is disposed across the first conductive portion (21b), and a plurality of first bent-back portions (23c) that is formed by bending the respective distal ends of the plurality of first leg portions (23a) and is locked with a second surface of the sheet body portion (10).