Clamp-Mounted Optical Element for LED Thermal Stress Relief
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing radiation-emitting devices with semiconductor components and optical elements face challenges in reliable connection under extreme environmental conditions due to different materials' thermal expansion coefficients and adhesive outgassing, which can lead to component damage and reduced lifespan.
Innovation Solution
A radiation-emitting device where an optical element is mechanically fixed to a semiconductor component using a clamp, eliminating the need for adhesives and allowing for a single process step connection that is not affected by environmental conditions or thermal expansion, ensuring a reliable and flexible connection without complex process controls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive bonding is used to connect semiconductor component and optical element, then connection is achieved, but reliability deteriorates under extreme environmental conditions due to thermal expansion differences and outgassing
Solution Approach 1:
The patent removes the adhesive layer from the connection system, eliminating the source of outgassing and thermal expansion stress. The optical element is directly mounted on the semiconductor component housing without any adhesive intermediary, thus extracting the harmful element from the system.
Solution Approach 2:
The patent introduces a metal housing as an intermediary structure between the semiconductor component and optical element. This housing provides a rigid mechanical support that accommodates both components with different thermal expansion coefficients without requiring adhesive bonding, thus mediating the connection in a thermally stable manner.
2Ease of manufacture
If adhesive bonding process is used, then connection is achieved, but manufacturing complexity increases due to process control requirements for adhesive amount and curing conditions
Solution Approach 1:
The patent eliminates the adhesive application and curing processes entirely by removing the adhesive layer from the manufacturing workflow. This extraction of the adhesive bonding step directly reduces process control complexity while maintaining connection functionality through direct mechanical mounting.
3Reliability
If high temperature soldering process is used to mount device on circuit board, then electrical connection is achieved, but adhesive-containing connections are adversely affected
Solution Approach 1:
By removing the adhesive layer from the device structure, the patent eliminates the vulnerable element that would be damaged by high-temperature soldering. The adhesive-free construction allows the device to withstand standard soldering processes without degradation of the connection materials.
Data Source
AI summary
A radiation-emitting device and a method for producing a radiation-emitting device are disclosed. In an embodiment, a radiation-emitting device comprises an optoelectronic semiconductor component and an optical element disposed downstream of the semiconductor component in an emission direction. The optical element is mechanically fixed to the semiconductor component by a clamp.