Clamping Element Recess Design for Mold-Safe Module Mounting

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Solution Overview

Problem

The existing fastening units for power semiconductor modules fail to securely mount the modules on coolers without damaging the mold, leading to potential particle contamination and reduced yield due to misalignment and pressure issues during the mounting process.

Innovation Solution

A clamping element with recessed areas that are free of the mold, allowing for direct contact with the baseplate while avoiding contact with the mold, and featuring contact areas with roughening for secure attachment and preventing lateral movement, along with holes for screw reception to ensure stable mechanical connection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a fastening unit is used to mount the power semiconductor module on a cooler, then the mechanical connection is improved, but the mold may be damaged causing particle contamination

Engineering Contradiction:

Improvemechanical connectionVSAvoidmold damage and particle contamination

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent extracts the harmful interaction between the fastening unit and the mold by creating a recess in the fastening unit. This recess prevents the fastening unit from contacting the mold directly, thereby taking out the source of damage and particle contamination while preserving the mechanical connection function.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The fastening unit is segmented into different functional zones: a contact area for pressing against the baseplate and a recessed area that avoids the mold. This segmentation allows the fastening unit to perform its clamping function while physically separating the pressing force application point from the mold location.

Inventive Principle:

Principle #1Segmentation

2Reliability

If pressure is applied during mounting to ensure secure attachment, then the mechanical connection is improved, but misalignment and mold damage occur

Engineering Contradiction:

Improvesecure attachmentVSAvoidalignment accuracy

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies local quality by creating a recess with specific geometric properties at the location where the fastening unit contacts the baseplate. This localized structural modification concentrates the pressing force on the baseplate while preventing force transmission to the mold, thereby achieving secure attachment without compromising alignment precision.

Inventive Principle:

Principle #3Local quality

3Stress or pressure

If the fastening unit contacts the mold during mounting, then the pressing force is distributed, but the mold is damaged leading to reduced yield

Engineering Contradiction:

Improveforce distributionVSAvoidmanufacturing yield

Core Design Contradiction:

Stress or pressureVSProductivity

Solution Approach 1:

The recess acts as an intermediary structural feature that mediates between the fastening unit's need to apply pressing force and the mold's vulnerability to damage. By introducing this intermediate element, the force is distributed through the baseplate rather than directly onto the mold, protecting the mold while maintaining effective clamping force.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentEP4095900B1Clamping element and method for producing a power semiconductor device

Publication Date: 2024.01.31 HITACHI ENERGY LTD

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AI summary

A clamping element (9) is specified configured to be pressed to a baseplate (2) of at least one power semiconductor module (1) comprising a mold (4), comprising - at least one contact area (10) being configured to be in direct contact to at least one clamping area (7) of the baseplate (2) being free of the mold (4), and - at least one recess (11) provided in the baseplate, wherein - the recess (11) and the contact area (10) are configured to face the baseplate. Further, a method for producing a power semiconductor device is specified.