Substrate Processing Clean Air Flow Control
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Solution Overview
Problem
The two-boat type substrate processing apparatus faces challenges in securing sufficient clean air flow due to interference from the boat exchange device, leading to particle stagnation and non-uniform wafer cooling, which decreases throughput and semiconductor device quality.
Innovation Solution
A substrate processing apparatus with multiple clean air suppliers positioned to control airflow around the boat exchanging device, ensuring a predetermined flow volume in key regions, including a first clean air supplier facing the unloading region, a second supplier facing a stand-by region, and a third supplier facing another stand-by region, all individually controlled to optimize airflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a boat exchange device is installed to enable two-boat operation, then throughput is improved, but the shape of the apparatus is limited and clean air flow volume is insufficient
Solution Approach 1:
The loading chamber is divided into multiple regions (unloading region, first stand-by region, second stand-by region) with dedicated clean air suppliers for each region. This segmentation allows independent control of clean air flow in each area, resolving the conflict between boat exchange device installation and sufficient clean air supply.
Solution Approach 2:
Clean air suppliers are positioned at different locations and orientations within the loading chamber to provide three-dimensional clean air coverage. The first clean air supplier faces the unloading region, the second faces the first stand-by region, and the third faces the second stand-by region, creating comprehensive airflow coverage that accommodates the boat exchange device while maintaining sufficient clean air flow volume.
2Ease of operation
If the apparatus shape is limited to accommodate the boat exchange device, then boat exchange is enabled, but clean air stagnation occurs and particles are not removed sufficiently
Solution Approach 1:
Different regions of the loading chamber are provided with dedicated clean air suppliers positioned and oriented to address specific local conditions. The first clean air supplier targets the unloading region, the second targets the first stand-by region, and the third targets the second stand-by region, ensuring each area receives adequate clean air flow to prevent particle stagnation while accommodating the boat exchange device.
3Object-affected harmful factors
If clean air flow volume is increased to remove particles, then particle removal is improved, but the apparatus design becomes more complex
Solution Approach 1:
The clean air supply mechanism is segmented into multiple independent clean air suppliers positioned at different locations within the loading chamber. Each supplier serves a specific region (unloading region, first stand-by region, second stand-by region), allowing targeted particle removal in each area without requiring a single complex high-volume supply system.
Solution Approach 2:
Multiple clean air suppliers are distributed throughout the loading chamber at different positions and orientations, creating a multi-dimensional clean air supply network. This approach achieves comprehensive particle removal coverage while maintaining manageable complexity through modular, distributed architecture rather than a single centralized system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances clean air flow and reduces particle generation, ensuring uniform wafer cooling and improved throughput by eliminating stagnation and optimizing airflow around the boat exchanging device.
Implementation Method 1
a flow volume of the clean air ejected from each of the first clean air supplier, the second clean air supplier and the third clean air supplier is individually controlled so as to form a predetermined air flow
Data Source
AI summary
Described herein is a technique capable of suppressing generation of particles and improving a throughput. According to one aspect of the technique, there is provided a substrate processing apparatus including: a loading chamber accommodating a boat; an elevator configured to elevate and lower the boat; a boat exchanging device configured move the boat on the elevator to a first stand-by region and a second stand-by region; a first clean air supplier facing an unloading region in the loading chamber where the boat placed on the elevator is accommodated; a second clean air supplier facing the first stand-by region; and a third clean air supplier facing the second stand-by region, wherein a flow volume ejected from the clean air suppliers are individually controlled so as to form a predetermined air flow in a range of height in which the boat exchanging device in the loading chamber is provided.