Cleaning Non-Bonding Surfaces to Suppress Void Formation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional bonding systems face issues with void formation due to deposits adhering to non-bonding surfaces of substrates, leading to misalignment and poor bonding quality during the bonding process of semiconductor wafers.
Innovation Solution
Incorporation of a cleaning apparatus that cleans the non-bonding surfaces of substrates before bonding, utilizing a polishing member and sponge to remove deposits and maintain surface flatness, combined with a surface modifying and hydrophilizing apparatus to prepare bonding surfaces for Van der Waals and hydrogen bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a bonding system performs plasma processing and hydrophilization on bonding surfaces, then bonding quality is improved, but deposits still adhere to non-bonding surfaces causing void formation
Solution Approach 1:
The cleaning apparatus performs preliminary cleaning of the non-bonding surfaces before the bonding process. The polishing member and sponge remove deposits from non-bonding surfaces in advance, preventing void formation during subsequent bonding operations.
Solution Approach 2:
The bonding system is divided into separate functional modules: a surface modifying apparatus for bonding surfaces, a cleaning apparatus for non-bonding surfaces, and a bonding apparatus. This segmentation allows each module to optimize its specific function without interfering with others.
2Manufacturing precision
If polishing members and sponges are used to clean non-bonding surfaces, then surface flatness is maintained, but device complexity increases
Solution Approach 1:
A sponge is introduced as an intermediary element between the polishing member and the non-bonding surface. The sponge applies gentle pressure and absorbs cleaning solutions, enabling effective cleaning while maintaining surface flatness without requiring complex mechanical pressure control systems.
3Reliability
If cleaning is performed on non-bonding surfaces before bonding, then void formation is suppressed, but processing time increases
Solution Approach 1:
The cleaning apparatus is integrated into the bonding system's processing flow, allowing continuous operation. The cleaning of non-bonding surfaces is performed as part of the overall bonding preparation process without requiring separate batch processing, maintaining continuous production flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses void formation and enhances bonding quality by ensuring clean, flat non-bonding surfaces, improving the precision and reliability of substrate bonding.
Implementation Method 1
after the surfaces of the substrates are modified in the surface modifying apparatus by performing a plasma processing on the surfaces of the substrates
Implementation Method 2
the surfaces of the substrates are hydrophilized in the surface hydrophilizing apparatus by supplying pure water onto the surfaces of the substrates
Implementation Method 3
the two sheets of substrates placed to face each other are bonded by a Van der Waals force and a hydrogen bond
Implementation Method 4
the two sheets of substrates placed to face each other are bonded by a Van der Waals force and a hydrogen bond
Data Source
AI summary
A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.