Cleaning Apparatus with Self-Cleaning Member for Semiconductor Substrates
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Solution Overview
Problem
In the process of forming patterns on substrates for device manufacturing, particle attachment to the substrate surfaces leads to pattern formation defects, such as shorts, due to inadequate cleaning techniques.
Innovation Solution
A cleaning apparatus with a substrate cleaner and a member cleaner that simultaneously cleans the substrate and the substrate cleaning member, utilizing a rotating and vibrating mechanism with protrusions to effectively remove particles, and a supply nozzle for cleaning liquids, ensuring thorough cleaning and reducing particle reattachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If only the substrate is cleaned without cleaning the substrate cleaning member, then the cleaning process is simple, but particles accumulate on the cleaning member and are reattached to the substrate, reducing cleaning effectiveness
Solution Approach 1:
The patent combines the substrate cleaning function and the cleaning member cleaning function into a single integrated cleaning apparatus. The substrate cleaning member serves dual purposes: cleaning the substrate during its primary function and being cleaned by the same apparatus during a secondary function, eliminating the need for separate cleaning equipment and reducing overall system complexity while maintaining high cleaning effectiveness
Solution Approach 2:
The cleaning apparatus enables the substrate cleaning member to clean itself through the member cleaner unit. The cleaning member is subjected to cleaning treatment by the apparatus that also cleans substrates, allowing it to remove accumulated particles and maintain its cleaning capability without requiring external intervention or separate maintenance equipment
2Manufacturing precision
If particles are not removed from the substrate cleaning member, then the apparatus structure remains simple, but pattern formation defects occur due to particle reattachment
Solution Approach 1:
The patent integrates the cleaning member cleaning function into the substrate cleaning apparatus by combining the substrate cleaner and member cleaner into one system. This merged structure enables simultaneous or sequential cleaning of both substrates and cleaning members, ensuring particle removal that prevents pattern formation defects while avoiding the need for entirely separate cleaning equipment
Solution Approach 2:
The patent introduces a cleaning liquid supply system as an intermediary medium that facilitates the cleaning of both substrates and cleaning members. The cleaning liquid acts as a mediator that transfers cleaning action from the apparatus to the cleaning member surface, effectively removing particles that would otherwise cause pattern formation defects
3Duration of action of moving object
If the substrate cleaning member is continuously used without cleaning, then operational time is maximized, but cleaning capability deteriorates due to particle accumulation
Solution Approach 1:
The patent enables continuous cleaning operation by implementing a dual-function apparatus that can clean substrates and clean the cleaning member itself. This continuity ensures that the cleaning member maintains its cleaning capability throughout extended operational periods, preventing capability deterioration while maximizing operational duration through uninterrupted useful action
Solution Approach 2:
The patent implements periodic cleaning cycles where the substrate cleaning member undergoes repeated cleaning treatment by the member cleaner unit. This periodic action removes accumulated particles at regular intervals, maintaining consistent cleaning capability throughout continuous operation and preventing the deterioration that would occur with uninterrupted use
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus improves cleaning capability, reducing pattern formation defects and faults by effectively removing particles from the substrate surface and maintaining cleanliness of the cleaning members, thereby enhancing the reliability of substrate cleaning processes.
Implementation Method 1
a substrate cleaning member (111) to clean a to-be-cleaned surface (SBa) of the substrate (SB)
Implementation Method 2
a member cleaner (120) to clean the substrate cleaning member (111)
Data Source
AI summary
According to one embodiment, there is provided a cleaning apparatus including a substrate cleaner and a member cleaner. The substrate cleaner has a substrate cleaning member placed over a first region to be opposite a substrate and a second region different from the first region. The member cleaner is placed adjacent to the second region.