Cleaning Device Hollow Cavity Prevents Liquid Backsplash
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Solution Overview
Problem
The existing cleaning apparatuses for semiconductor wafers face contamination due to liquid backsplash during high-speed rotation, where cleaning solutions are flung off and collide with the chamber wall, returning to the wafer surface and degrading the cleaning process performance.
Innovation Solution
A cleaning device with an upper and lower casing design, featuring liquid inlet apertures and a hollow cavity, where the upper casing moves relative to the lower casing to introduce and discharge cleaning solutions, preventing backsplash by distributing and discharging liquids through uniformly distributed apertures, thus maintaining a simple and easy-to-clean structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If additional components are added to the process chamber to prevent liquid backsplash, then contamination prevention is improved, but device complexity increases and subsequent cleaning processes become difficult
Solution Approach 1:
The process chamber is divided into an upper chamber and a lower chamber separated by a partition wall. The partition wall includes multiple through holes that segment the liquid flow path, allowing liquid to pass through in a controlled manner rather than freely backsplashing. This segmentation prevents contamination while maintaining a relatively simple overall structure that remains easy to clean.
2Productivity
If the wafer rotates at high speed to improve cleaning effect, then cleaning performance is improved, but liquid backsplash increases causing contamination
Solution Approach 1:
The partition wall with through holes acts as an intermediary structure between the spray nozzle and the wafer surface. It mediates the liquid flow by allowing controlled passage through the holes while preventing the harmful backsplash effect. This enables high-speed rotation to maintain cleaning effectiveness without the detrimental contamination from liquid backsplash.
3Object-affected harmful factors
If the process chamber structure is made complex to prevent backsplash, then contamination is reduced, but ease of operation deteriorates due to difficult cleaning processes
Solution Approach 1:
The partition wall with through holes segments the chamber into upper and lower parts, preventing contamination through controlled liquid flow. The segmented design with clear separation and removable components maintains ease of operation, allowing straightforward access for cleaning the wafer surface and chamber components without navigating complex structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents contamination by effectively managing the flow of cleaning solutions during high-speed rotation, ensuring better cleaning performance and easy waste collection, while maintaining a straightforward and efficient cleaning process.
Implementation Method 1
during the high speed rotation of the wafer, the cleaning solution will be flung off the wafer surface and collide with a surrounding process chamber wall under the centrifugal force
Data Source
AI summary
The present invention provides a cleaning device resistant to liquid backsplash comprises an upper casing and a lower casing. The upper casing moves upward and downward relative to the lower casing. The upper casing comprises an inner wall, an outer wall, and a hollow cavity formed therebetween. The inner wall is provided with a plurality of liquid inlet apertures which are communicated with the hollow cavity. Through the liquid inlet apertures and the hollow cavity provided in the cleaning device and the cleaning system of the present invention, the chemical liquids and/or particles used are introduced into the hollow cavity via the liquid inlet apertures and discharged via the liquid discharging apertures during the high speed rotation of the wafer so as to achieve better cleaning device.