Cleaning Device Reset Operation for Substrate Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The maintenance of substrate processing apparatuses, particularly the adjustment and reset operations of cleaning devices, are complicated and time-consuming due to variations in cleaning member weights and positional relationships, leading to inconsistencies in load measurement and cleaning efficiency.
Innovation Solution
A cleaning device with an elastically deformable cleaning member, a measurement portion, and a controller that performs a reset operation by pressing the cleaning member against a reference member, allowing for precise setting of the reference position and pressing reference value, enabling accurate load control and reduced operator variability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the cleaning member is moved at high speed to a position close to the substrate and then at low speed to contact position, then the cleaning time is reduced and impact is minimized, but the reference position setting becomes complicated and time-consuming after maintenance
Solution Approach 1:
The system performs automatic reference position setting using the measurement portion to detect when the cleaning member contacts the substrate, eliminating the need for manual operator adjustment. The controller automatically determines the reference position based on measurement values, making the system self-calibrating after maintenance.
Solution Approach 2:
The system changes the parameter being monitored from positional information to load measurement information. By using the measurement portion to detect load changes when the cleaning member contacts the substrate, the system automatically identifies the reference position without complex positional adjustments or manual intervention.
2Productivity
If the reference position is set close to the substrate to reduce cleaning time, then productivity increases, but the impact upon contact increases causing substrate damage
Solution Approach 1:
The measurement portion provides real-time feedback on the load applied by the cleaning member to the substrate. The controller uses this feedback to dynamically adjust the cleaning member's position and pressing force, ensuring optimal cleaning efficiency while preventing substrate damage through continuous monitoring and adjustment.
Solution Approach 2:
The system transitions from static reference position setting to dynamic load-based control. The cleaning member's position and pressing force are continuously adjusted based on real-time measurement feedback, allowing the system to adapt to varying conditions while maintaining safe operating parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the reset operation, reduces maintenance time, and ensures precise load control, minimizing substrate damage and process time by setting the reference position close to the substrate without contact, thus enhancing cleaning efficiency and consistency.
Implementation Method 1
a measurement portion (for example, a load cell and the like) that measures the load of the cleaning member against the substrate
Data Source
AI summary
A cleaning device is described. In one embodiment, the cleaning device includes a cleaning member; a moving portion, a measurement portion, and a controller. The controller performs a reset operation in which the cleaning member is pressed against the reference member before cleaning, a cleaning member is moved in a direction away from the reference member after the measured value of the measurement portion reaches a predetermined reset load, when the measurement values of the measurement portion for each unit movement amount of the cleaning member become equal to each other at least twice consecutively, a position of the cleaning member at the time is set as a reference position of the cleaning member at the time of cleaning, and the measurement value of the measurement portion at the time is set as a pressing reference value at the time of cleaning.


