Selective Cleaning Gas Valve Unit for Deposition Heads
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing deposition methods lack the ability to selectively and efficiently clean individual nozzles of deposition heads, leading to contamination and reduced process efficiency, especially when performing hybrid deposition processes like ALD and CVD simultaneously.
Innovation Solution
A deposition apparatus with a cleaning gas valve unit that allows selective supply of cleaning gas to individual deposition heads, enabling targeted cleaning of nozzles through a system of valves and exhaust units, ensuring only contaminated nozzles are cleaned, thereby reducing process time and material costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cleaning gas is supplied to all deposition heads simultaneously, then all nozzles are cleaned, but process time increases and unnecessary cleaning occurs
Solution Approach 1:
The cleaning gas valve unit is divided into multiple independent valves (first cleaning gas valve for first deposition head, second cleaning gas valve for second deposition head). Each valve can be independently controlled to supply cleaning gas to specific deposition heads, enabling selective cleaning of only those nozzles that require it, thus reducing unnecessary cleaning operations and process time while maintaining cleaning effectiveness.
2Reliability
If cleaning gas is supplied to all nozzles, then contamination is prevented, but material costs increase due to excessive cleaning gas consumption
Solution Approach 1:
The system applies different cleaning operations to different locations (deposition heads) based on their specific needs. The cleaning gas valve unit enables localized cleaning by supplying cleaning gas only to deposition heads that require it, rather than uniformly cleaning all deposition heads. This reduces cleaning gas consumption while maintaining contamination prevention where necessary.
3Measurement precision
If individual nozzle cleaning is implemented, then cleaning precision improves, but device complexity increases due to additional valves and control mechanisms
Solution Approach 1:
The cleaning gas valve unit is segmented into independent valves for each deposition head, with each valve controlling cleaning gas supply to a specific deposition head. This segmentation enables precise control over which nozzles are cleaned, improving cleaning precision. The modular structure of individual valves makes the complexity manageable and allows for independent control of each cleaning operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient and targeted cleaning of deposition nozzles, reducing contamination, saving time, and increasing process efficiency by selectively cleaning only the necessary components during hybrid deposition processes like ALD and CVD.
Implementation Method 1
A cleaning gas supply unit is configured to supply a cleaning gas into the chamber
Implementation Method 2
An exhaust unit is configured to discharge the cleaning gas and remaining source and mixture gases from the chamber
Data Source
AI summary
A deposition apparatus includes a deposition gas supply unit including an opening and closing valve. The deposition gas supply unit is configured to selectively supply a source gas or a mixture gas into a chamber. A cleaning gas supply unit is configured to supply a cleaning gas into the chamber. A deposition head includes a first deposition head including a first nozzle configured to supply the source gas and the cleaning gas and a second deposition head including a second nozzle configured to supply the source gas, the mixture gas, and the cleaning gas. An exhaust unit is configured to discharge the cleaning gas and remaining source and mixture gases from the chamber. A cleaning gas valve unit is configured to be selectively opened and closed to supply the cleaning gas to at least any one of the first deposition head and the second deposition head.